-
-
News
News Highlights
- Books
Featured Books
- design007 Magazine
Latest Issues
Current IssueCreating the Ideal Data Package
Why is it so difficult to create the ideal data package? Many of these simple errors can be alleviated by paying attention to detail—and knowing what issues to look out for. So, this month, our experts weigh in on the best practices for creating the ideal design data package for your design.
Designing Through the Noise
Our experts discuss the constantly evolving world of RF design, including the many tradeoffs, material considerations, and design tips and techniques that designers and design engineers need to know to succeed in this high-frequency realm.
Learning to Speak ‘Fab’
Our expert contributors clear up many of the miscommunication problems between PCB designers and their fab and assembly stakeholders. As you will see, a little extra planning early in the design cycle can go a long way toward maintaining open lines of communication with the fab and assembly folks.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - design007 Magazine
SEMI Reports Typical Q1 2025 Semiconductor Seasonality with Potential for Atypical Shifts Due to Tariff Uncertainty
May 19, 2025 | SEMIEstimated reading time: 2 minutes
According to the Q1 2025 Semiconductor Manufacturing Monitor (SMM) Report released by SEMI in collaboration with TechInsights, the global semiconductor manufacturing industry entered 2025 with typical seasonal patterns. However, looming tariff threats and evolving supply chain strategies are expected to create atypical seasonality for several industry segments as the year progresses.
Despite heightened trade policy risks, current data for the first quarter of 2025 indicate that electronics and integrated circuit (IC) sales have not been directly impacted by the newly announced tariffs. Electronics sales declined 16% quarter-over-quarter (QoQ) in Q1 2025 and remained flat year-over-year (YoY), consistent with traditional seasonal patterns. IC sales contracted by 2% QoQ but posted a robust 23% YoY increase, reflecting ongoing investment in AI and high-performance computing infrastructure.
“While the first quarter of 2025 did not see a direct impact from new tariffs on electronics and IC sales, the uncertainty around global trade policies is prompting some companies to accelerate shipments and others to pause investments,” said Clark Tseng, Senior Director of Market Intelligence at SEMI. “This push-pull dynamic could lead to atypical seasonality for the remainder of the year as the industry adapts to shifting supply chain and tariff landscapes.”
Semiconductor capital expenditures (CapEx) declined 7% QoQ but surged 27% YoY, as manufacturers continued to invest heavily in leading-edge logic, high-bandwidth memory (HBM) and advanced packaging to support AI-driven applications. Memory-related CapEx soared 57% YoY in Q1 2025, while non-memory CapEx expanded by 15% YoY, underscoring the industry’s focus on innovation and resilience.
Wafer fab equipment (WFE) spending rose 19% year-over-year in Q1 2025 and is projected to increase another 12% in Q2, driven by strong investments in advanced logic and memory production to support the rapid adoption of AI semiconductors. Test equipment billings surged 56% year-over-year in Q1 and are expected to grow by 53% in Q2, reflecting the heightened complexity and stringent performance requirements of AI and HBM chip testing. Assembly and packaging equipment also registered double-digit growth, benefiting from the industry’s push toward higher-density integration and advanced packaging solutions.
“The WFE market is poised for steady growth driven by government investments and semiconductor advancements, particularly in AI and emerging technologies,” said Boris Metodiev, Director of Market Analysis at TechInsights. “However, geopolitical uncertainties, including export restrictions and potential tariffs, pose significant risks that could impact this positive trajectory.”
Aligned with the growth in capital equipment investments, global installed wafer fab capacity is on the rise and is projected to surpass 42.5 million wafers per quarter (in 300mm wafer equivalents), reflecting a 2% QoQ and 7% YoY increase in Q1 2025. China continues to lead all regions in capacity expansion, though the pace of growth is expected to moderate in the coming quarters. Notably, Japan and Taiwan are experiencing the strongest quarterly capacity gains, driven by significant investments in power semiconductor manufacturing in Japan and the ramp-up of a leading-edge foundry in Taiwan.
Looking ahead, SEMI and TechInsights expect the industry to experience atypical seasonal patterns in 2025 as companies navigate the dual challenges of trade policy uncertainty and supply chain adaptation. While demand for AI and data center technologies remains a bright spot, other segments may see delayed investment or demand shifts as the market responds to evolving tariff and geopolitical uncertainties.
Suggested Items
DuPont Achieves 100% Renewable Electricity Across its European Union Operations
05/28/2025 | DuPontDuPont announced 100 percent of its grid electricity is from renewable sources across its entire European Union (EU) operations, through the use of Renewable Energy Certificates (RECs).
NVIDIA Expected to Launch RTX PRO 6000 Special Edition for China’s AI Market, Potentially Boosting Future GDDR7 Demand
05/28/2025 | TrendForceTrendForce reports that following the new U.S. export restrictions announced in April—which require additional permits for the export of NVIDIA’s H20 or any chips with equivalent memory bandwidth or interconnect performance to China—NVIDIA is expected to release a special low-power, downscaled version of the RTX PRO 6000 (formerly B40) for the Chinese market.
CIMS to Exhibit at JPCA Show 2025
05/28/2025 | CIMSCIMS is excited to announce our participation at JPCA 2025 in Tokyo, Japan! Join us from June 4-6.
Imec Unveils Record-Low Loss 300mm RF Silicon Interposer for Sub-THz Systems
05/27/2025 | ImecAt the IEEE ECTC 2025 conference, imec – a world-leading research and innovation hub in nanoelectronics and digital technologies – highlights the exceptional performance and flexibility of its 300mm RF silicon interposer platform.
Mycronic Executes Share Split and Determines Record Date
05/27/2025 | MycronicThe annual general meeting of Mycronic AB (publ) held on May 7, 2025, resolved to increase the number of shares by a share split, whereby one (1) existing share will be split into two (2) shares.