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We take the pulse of the PCB industry by sharing insights from leading fabricators and suppliers in this month's issue. We've gathered their thoughts on the new U.S. administration, spending, the war in Ukraine, and their most pressing needs. It’s an eye-opening and enlightening look behind the curtain.
The Essential Guide to Surface Finishes
We go back to basics this month with a recount of a little history, and look forward to addressing the many challenges that high density, high frequency, adhesion, SI, and corrosion concerns for harsh environments bring to the fore. We compare and contrast surface finishes by type and application, take a hard look at the many iterations of gold plating, and address palladium as a surface finish.
It's Show Time!
In this month’s issue of PCB007 Magazine we reimagine the possibilities featuring stories all about IPC APEX EXPO 2025—covering what to look forward to, and what you don’t want to miss.
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Real Time with... IPC APEX EXPO 2025: New Dispensing and Coating Solutions from Rehm
April 3, 2025 | Real Time with...IPC APEX EXPOEstimated reading time: Less than a minute

Michael Hanke, Global Sales Officer at Rehm, discusses new dispensing and coating equipment developed in Germany. He emphasizes the significance of software integration with customer systems to tackle market challenges. Ongoing software development is crucial for future-proofing solutions. Michael also introduces vapor phase soldering technology, which provides energy savings and innovative flux-free pastes, leading to high customer acceptance due to secure, time-saving solutions.
The 25th IPC APEX EXPO, March 18-20, 2025, at the Anaheim Convention Center in California, has concluded successfully. If you couldn’t make it to the show, don’t worry—the I-Connect007 team has coverage of the entire week’s events. Don’t miss our Real Time with… IPC APEX EXPO 2025 video interviews with the movers and shakers of the electronics industry.
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Siemens, TSMC Extend Collaboration to Drive Semiconductor Design Innovation
04/25/2025 | SiemensSiemens Digital Industries Software announced that the company has deepened longstanding collaboration with TSMC to drive innovation in semiconductor design and integration, enabling mutual customers to tackle the challenges of next-generation technologies.
HEITEC Expands Deployment of Aegis Software’s FactoryLogix MES to Boost Sustainable Manufacturing
04/23/2025 | Aegis SoftwareAegis Software, a global provider of Manufacturing Execution System (MES) software, announces that HEITEC’s business unit Elektronik, a leading manufacturer of complex electronic solutions based in Eckental, Germany, is expanding its use of the FactoryLogix® MES platform to additional products.
IPC Releases Version 2.0 of IPC-2591, Connected Factory Exchange, with Expanded Device Coverage and Smarter Data
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Yamaha Boosts YRi-V AOI Productivity with 3D Component Update
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STMicroelectronics Future-proofs the Development of Next-gen Cars with Innovative Memory Solution for Automotive Microcontrollers
04/22/2025 | STMicroelectronicsSTMicroelectronics, a global semiconductor leader serving customers across the spectrum of electronics applications, has announced Stellar with xMemory, a new generation of extensible memory embedded into its Stellar series of automotive microcontrollers, that transforms the challenging process of developing software-defined vehicles (SDV) and evolving platforms for electrification.