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Coming Soon: The Advanced Electronics Packaging Digest
August 27, 2025 | Marcy LaRont, I-Connect007Estimated reading time: 1 minute
The upcoming Advanced Electronics Packaging Digest is a curated, condensed monthly publication designed to keep you informed and engaged with the fast-moving world of advanced electronics packaging (AEP).
In our inaugural September issue, we will begin at the foundation with an in-depth interview featuring Matt Kelly, CTO of the Global Electronics Association. Kelly and his Technology Solutions Team approach advanced packaging from a holistic systems perspective. In this interview, he explains the concepts and tactical realities behind the term “advanced electronics packaging,” emphasizing why a systems approach is critical to developing reliable, scalable, and sustainable solutions. With billions of dollars riding on this sector of electronics manufacturing, and mounting pressure to meet unprecedented demand for modern electronic products, data processing, and storage, Kelly makes a compelling case for getting it right early in the process.
Also included in this first issue:
- A recent Global Electronics Association white paper that more fully explains the concept of advanced electronics packaging
- The first installment in a new series from automotive and EV expert Stanton (Stan) Rak, who explores the rapidly evolving technology requirements in automotive electronics, both current and future
- A curated selection of recent news highlights
- A global events calendar dedicated to advanced packaging, ensuring you have the latest resources at your fingertips
Looking ahead, our October issue will launch a new series of company and personnel spotlights, showcasing the innovators driving progress in this complex and highly technical field. We’ll also feature insights from a supplier focused on PCB and interconnect solutions designed to address one of the industry’s greatest challenges: thermal management in advanced packaging designs.
We invite you to subscribe today to stay informed and connected. If you’re interested in contributing to the digest or would like to suggest topics for future coverage, please reach out to marcy@iconnect007.com.
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Brent Fischthal - Koh YoungSuggested Items
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
09/19/2025 | Nolan Johnson, I-Connect007We definitely have advanced packaging on our minds this week at I-Connect007. We just launched our monthly “Advanced Electronic Packaging Digest,” and we’re feeling the excitement. Whenever we find ourselves in the middle of a technological sea change, we’re in for some fun.
NEOTech Celebrates Sixth Mexico Technology Award Win for Outstanding EMS Services Over $100M
09/19/2025 | NEOTechNEOTech, a leading provider of electronic manufacturing services (EMS), design engineering, and supply chain solutions in the high-tech industrial, medical device, and aerospace/defense markets, is proud to announce that it has once again earned the prestigious Mexico Technology Award in the category of EMS Services > $100 Million.
Electrodeposited Copper Foils Market to Grow by $11.7 Billion Over 2025-2032
09/18/2025 | Globe NewswireThe global electrodeposited copper foils market is poised for dynamic growth, driven by the rising adoption in advanced electronics and renewable energy storage solutions.
Breakthrough in Non-Contact Solder Removal Earns Kurtz Ersa 2025 Mexico Technology Award at SMTA Guadalajara
09/18/2025 | Kurtz Ersa Inc.Kurtz Ersa Inc., a leading supplier of electronics production equipment, is proud to announce that it has been awarded a 2025 Mexico Technology Award in the category of Rework & Repair for its HR 600P Automatic Rework System.
A.R.T. Invests in Latest Equipment to Further Enhance Electronics Training Facilities
09/17/2025 | A.R.T. Ltd.Advanced Rework Technology Ltd. (A.R.T.), a leading independent IPC-accredited training provider, has announced a series of new equipment investments at its state-of-the-art training centre.