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Real Time with... IPC APEX EXPO 2025: Transforming Engineering With Digital Solutions from Zuken
March 27, 2025 | Real Time with...IPC APEX EXPOEstimated reading time: Less than a minute

Bob Potock discusses Zuken's focus on digital engineering and a move away from traditional document-based processes to model-based designs. This change improves product definition, reduces design errors, and optimizes product parameters. Bob notes that the IPC-2581 standard is crucial for connecting designs, while AI enhances design efficiency. Connected manufacturing links design outputs directly to machines, reducing human error. The concept of digital twins is also discussed, showcasing AI's role in design optimization.
The 25th IPC APEX EXPO, March 18-20, 2025, at the Anaheim Convention Center in California, has concluded successfully. If you couldn’t make it to the show, don’t worry—the I-Connect007 team has coverage of the entire week’s events. Don’t miss our Real Time with… IPC APEX EXPO 2025 video interviews with the movers and shakers of the electronics industry.
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I-Connect007 Editor’s Choice: Five Must-Reads for the Week
03/28/2025 | Andy Shaughnessy, I-Connect007I’ve spent my week recovering from a busy and interesting week in Anaheim for the 25th IPC APEX EXPO. I think back to my first APEX EXPO, and the changes since then are too numerous to count. I first attended in 2004, also in Anaheim, back when there was almost no design content in the conference or expo portions of the show. It was just a few years after the downturn, and attendees and exhibitors alike were skittish, almost afraid to show confidence in our industry. A few unemployed design friends handed out copies of their resumes. Travel budgets were still down, and the aisles weren’t exactly packed with traffic.
HARTING 3D-Circuits Leads 3D-MID Innovation: Transforming Consumer Electronics with Advanced Technology
03/27/2025 | PRNewswireThe consumer electronics industry is experiencing a remarkable transformation, propelled by rapid technological advancements and an increasing demand for compact, efficient, and multifunctional devices. Central to this evolution is 3D-MID (Three-Dimensional Mechatronic Integrated Devices) technology, which redefines design standards and drives innovation.
GlobalFoundries Certifies Ansys Lumerical Photonic Design Tools for GF Fotonix™ Platform
03/27/2025 | PRNewswireAnsys and GlobalFoundries collaborated to certify four Ansys photonic solvers, empowering engineers to simulate passive and active photonic components with high-fidelity in the GF Fotonix platform.
Real Time with... IPC APEX EXPO 2025: Emphasizing Sustainability in PCB Design with Summit Interconnect
03/27/2025 | Real Time with...IPC APEX EXPOAndy Shaughnessy and Gerry Partida of Summit Interconnect discuss the rising customer interest in sustainability within PCB design. Gerry points out that many designs neglect sustainability, resulting in low yields and higher costs. The conversation stresses the importance of adhering to PCB standards and collaborating with fabricators to tackle design challenges and enhance sustainability.
DigiKey Announces Sponsorship of KiCad to Support Open-Source EDA Development
03/26/2025 | DigiKeyDigiKey, a leading global commerce distributor offering the largest selection of technical components and automation products in stock for immediate shipment, is proud to announce its continued sponsorship of KiCad, the leading open-source Electronic Design Automation (EDA) suite, reinforcing a shared commitment to advancing open-source tools for the electrical engineering community.