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Teradyne Announces Production System for Double-Sided Wafer Probe Test for Silicon Photonics

04/02/2025 | Teradyne
Teradyne, a leading provider of automated test equipment, has partnered with ficonTEC, a global leader in production solutions for photonics assembly and test, to announce the availability of the first high-volume, double-sided wafer probe test cell for silicon photonics.

Nolan’s Notes: Looking Deep Into the Future With X-ray

04/02/2025 | Nolan Johnson -- Column: Nolan's Notes
As a diagnostic tool, X-ray has been around for over a century, and available to EMS inspection for some years. It seems the industry has moved far enough forward to fully embrace X-ray on the assembly line. I’m reminded of Wayne Gretzky’s famous comment about the secret to his scoring success: “I skate to where the puck will be, not where the puck is.” I liken that to X-ray inspection, which has been standing here all this time waiting for the industry to catch up. Has X-ray’s time finally come in electronics manufacturing?

Delvitech Expands Its Presence in Germany with the Appointment of Bijan Thomas Rahideh as Representative

03/31/2025 | Delvitech
Delvitech, a leader in AI-driven automated optical inspection solutions, is strengthening its position in the German-speaking market by appointing Bijan Thomas Rahideh as its representative for Bavaria, Austria, and German-speaking regions of Switzerland.

GlobalFoundries Certifies Ansys Lumerical Photonic Design Tools for GF Fotonix™ Platform

03/27/2025 | PRNewswire
Ansys and GlobalFoundries collaborated to certify four Ansys photonic solvers, empowering engineers to simulate passive and active photonic components with high-fidelity in the GF Fotonix platform.

Point2 Technology, Sumitomo Electric Industries New Partnership

03/26/2025 | Point2 Technology
Point2 Technology, a leading provider of ultra-low-power, low-latency mixed-signal SoC solutions for multi-terabit interconnect, and Sumitomo Electric Industries, Ltd. (SEI), a global leader in high-speed communication systems, announced the signing of a Memorandum of Understanding (MOU) to collaborate on the development of SEI’s next-generation 25G optical transceiver modules.
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