-
- News
- Books
Featured Books
- design007 Magazine
Latest Issues
Current IssueCreating the Ideal Data Package
Why is it so difficult to create the ideal data package? Many of these simple errors can be alleviated by paying attention to detail—and knowing what issues to look out for. So, this month, our experts weigh in on the best practices for creating the ideal design data package for your design.
Designing Through the Noise
Our experts discuss the constantly evolving world of RF design, including the many tradeoffs, material considerations, and design tips and techniques that designers and design engineers need to know to succeed in this high-frequency realm.
Learning to Speak ‘Fab’
Our expert contributors clear up many of the miscommunication problems between PCB designers and their fab and assembly stakeholders. As you will see, a little extra planning early in the design cycle can go a long way toward maintaining open lines of communication with the fab and assembly folks.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - design007 Magazine
ioTech’s io600 Wins Prestigious EIC Accelerator Award for Semiconductor Innovation
January 31, 2025 | ioTechEstimated reading time: 1 minute
Reophotonics Ltd, a member of the ioTech group, is proud to announce it has received the highly prestigious EIC Accelerator Award from the European Innovation Council (EIC) and SMEs Executive Agency (EISMEA). This recognition highlights the transformative impact of the io600 Digital Deposition System on semiconductor manufacturing.
The EIC jury praised the io600 as a “game-changer,” citing its ability to strengthen and scale up production and innovation across Europe’s semiconductor value chain. This award aligns with the ambitious objectives of the European Chips Act, which aims to bolster Europe’s competitiveness in the global semiconductor market through innovation, sustainability, and advanced manufacturing capabilities.
“The io600 responds to market needs,” the jury stated. “It will enable further miniaturization, realize features and structures currently impossible to manufacture” and “it will significantly increase throughput, yield, and sustainability.”
By addressing these critical industry challenges, the io600 empowers manufacturers to unlock faster, more accurate, and environmentally friendlier production processes. Its ability to create structures that traditional methods cannot produce marks a significant step forward for semiconductor innovation.
“This award testifies to our commitment to push the boundaries of semiconductor packaging,” said Hervé Javice, CEO of ioTech Reophotonics. “The cutting-edge io600 is perfectly aligned with the objectives of the European Chips Act, and we are proud to play a key role in strengthening Europe’s semiconductor capabilities.”
Reophotonics congratulates the other award recipients and looks forward to further advancing electronics manufacturing through the io600’s revolutionary technology.
Suggested Items
ESIA Statement on EU Funding for Competitiveness: A New Approach is Needed
05/09/2025 | ESIAThe European Semiconductor Industry Association (ESIA), representing the European leadership in semiconductor research, design, and manufacturing, would like to underscore the need for targeted and sustained investment to strengthen Europe’s strategic sectors.
Imec Coordinates EU Chips Design Platform
05/09/2025 | ImecA consortium of 12 European partners, coordinated by imec, has been selected in the framework of the European Chips Act to develop the EU Chips Design Platform.
German Government Issues Final Funding Approval For New Infineon Fab In Dresden
05/08/2025 | InfineonInfineon Technologies AG has received final approval for the funding of its new plant in Dresden (Smart Power Fab) from the German Federal Ministry for Economic Affairs.
Jenoptik Fab Officially Inaugurated in Dresden
05/07/2025 | JenoptikJenoptik manufactures micro-optics for the semiconductor equipment industry in a state-of-the-art production environment.
StratEdge LPA-Series Semiconductor Packages Take Center Stage at CS Mantech and Space Tech Expo USA
05/07/2025 | StratEdgeStratEdge Corporation will display its thermally efficient Leaded Power Amplifier (LPA) packages in Booth 805 at CS Mantech.