-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueInventing the Future with SEL
Two years after launching its state-of-the-art PCB facility, SEL shares lessons in vision, execution, and innovation, plus insights from industry icons and technology leaders shaping the future of PCB fabrication.
Sales: From Pitch to PO
From the first cold call to finally receiving that first purchase order, the July PCB007 Magazine breaks down some critical parts of the sales stack. To up your sales game, read on!
The Hole Truth: Via Integrity in an HDI World
From the drilled hole to registration across multiple sequential lamination cycles, to the quality of your copper plating, via reliability in an HDI world is becoming an ever-greater challenge. This month we look at “The Hole Truth,” from creating the “perfect” via to how you can assure via quality and reliability, the first time, every time.
- Articles
- Columns
- Links
- Media kit
||| MENU - pcb007 Magazine
Sony Honda Mobility, Qualcomm Extend Technology Collaboration to Bring GenAI Capabilities to Future Vehicles
January 10, 2025 | Qualcomm Technologies, Inc.Estimated reading time: 2 minutes
Sony Honda Mobility Inc. (SHM) and Qualcomm Technologies, Inc. have announced the expansion of their technology collaboration to integrate the latest generation of Snapdragon® Digital Chassis™ solutions into its future AFEELA vehicles, marking a significant advancement in the development of software-defined vehicles (SDVs). The next phase of this collaboration aims to enhance the next generation of AFEELA vehicles with cutting-edge features, including edge generative artificial intelligence (GenAI) for more intuitive and personalized in-car experiences, advanced driver assistance systems (ADAS), and seamless connectivity powered by Qualcomm Technologies’ comprehensive, cloud-connected Snapdragon Digital Chassis solutions. The companies' expanded relationship underscores Sony Honda Mobility and Qualcomm Technologies’ continued commitment to delivering state-of-the-art technology and unparalleled user experiences in the automotive industry.
This expanded collaboration between SHM and Qualcomm Technologies is set to redefine SHM’s vision by delivering AFEELA vehicles that are smart, connected, and truly reflective of Sony's legacy in high-quality entertainment and Honda's commitment to automotive excellence. Together, SHM and Qualcomm Technologies are paving the way for a future where technology and mobility seamlessly converge, providing drivers and passengers with a next-generation automotive experience.
The First AFEELA vehicles equipped with Snapdragon Digital Chassis solutions are expected to start deliveries in 2026. Reservations will be available this year.
Snapdragon Digital Chassis platforms for AFEELA vehicles:
- The Snapdragon® Cockpit Platform powers AFEELA's in-vehicle entertainment and cockpit, delivering high-quality audio and rich 3D visual experiences to enable enjoyable and immersive moments in the car, whether you're listening to music, watching a movie, or playing a game. Leveraging the platform’s support for GenAI capabilities, SHM will transform the cabin into a digital haven, offering personalized content and AI enabled interactive features that enhance the driving and passenger experience.
- Snapdragon® Auto Connectivity Platforms offer robust, security-rich connectivity for infotainment systems and precise positioning to enable secure vehicle connection, providing comprehensive access to entertainment, navigation, and other digital services.
- Snapdragon® Ride Platform provides AFEELA with an open and customizable solution for developing advanced driver assistance system (ADAS) features. This platform offers flexibility with low power and high throughput and a production-grade toolchain for AI integration and data handling. The Snapdragon Ride solution is designed with safety and advanced automation in mind, enabling the creation of sophisticated systems that offer a smooth, automated driving experience.
“Our collaboration with Sony Honda Mobility underscores our unwavering commitment to advancing automotive technology for next-generation vehicles,” said Nakul Duggal, group general manager, automotive, industrial, and loud, Qualcomm Technologies, Inc. “We are thrilled to strengthen our relationship by equipping upcoming AFEELA vehicles with cutting-edge technologies like GenAI, delivering premium, sophisticated, and safety-rich riding experiences that redefine the future of mobility.”
"By integrating Qualcomm Technologies’ Snapdragon Digital Chassis and GenAI into our AFEELA brand, we are taking a significant step towards realizing our vision of software-defined vehicles,” said Izumi Kawanishi, representative director, president, chief operating officer, Sony Honda Mobility. “This relationship allows us to offer our customers a seamless and connected driving experience, combining the best of automotive and digital innovation, and transforming the mobility space into an entertainment space.”
Testimonial
"In a year when every marketing dollar mattered, I chose to keep I-Connect007 in our 2025 plan. Their commitment to high-quality, insightful content aligns with Koh Young’s values and helps readers navigate a changing industry. "
Brent Fischthal - Koh YoungSuggested Items
Dymax Mexico to Showcase Light-Curing Technologies at SMTA Guadalajara Expo & Tech Forum 2025
09/05/2025 | DymaxDymax, a global manufacturer of rapid light-curing materials and equipment, will participate in SMTA Guadalajara Expo & Tech Forum, taking place September 17-18, 2025, at the Guadalajara Expo Center in Guadalajara, Jalisco, Mexico.
Kris Moyer Discusses His Emerging Design Technologies Class
09/04/2025 | Marcy LaRont, I-Connect007Kris Moyer, a design instructor for the Global Electronics Association, will be teaching his advanced PCB design class this fall. If you’re ready to level up your design education, you won’t want to miss this interview. The PCB Design for Emerging Design Technologies course is designed to provide the skills necessary to create PCB/PBA designs that require cutting-edge emerging design technologies and comply with all necessary IPC standards, including new standards being developed in this area.
TTM Technologies: Bridging East and West with Strategic Expansion
08/25/2025 | Marcy LaRont, I-Connect007As global supply chains shift and demand for supply chain resiliency grows, TTM Technologies is expanding with purpose: bolstering its U.S. presence while maintaining a strong footprint in Asia. With recent moves in Wisconsin and Malaysia, the company is positioning itself to better support customers amid an evolving geopolitical landscape. In this interview, President and CEO of TTM Technologies Tom Edman discusses TTM’s expansion strategy, the future of manufacturing, and his planned retirement after his long tenure at the helm of the company.
MS2 Technologies, LLC/P. Kay Focuses on Central America with First Installation in Honduras
08/24/2025 | P. Kay Metal, Inc.This year MS2 Technologies has turned their focused to the growing electronics market in Central America. With that focus came the adaptation of MS2 and the Akila System from a Honduras-based corporation with manufacturing plants in both Honduras and Mexico.
Ecolab to Acquire Ovivo’s Electronics Ultra-Pure Water Business
08/15/2025 | EcolabEcolab Inc. has entered into a definitive agreement to acquire Ovivo’s Electronics business, a leading and fast-growing global provider of breakthrough ultra-pure water technologies for semiconductor manufacturing.