Fresh PCB Concepts: Traceability in PCB Design
The Shaughnessy Report: Back to the Future
Designers Notebook: Addressing Future Challenges for Designers
SMTA UMW Chapter Kicks Off 2025 with 'Manufacturing by Design is the New DFM' Technical Session
January 6, 2025 | SMTAEstimated reading time: Less than a minute
The Upper Midwest Chapter (UMW) of the Surface Mount Technology Association (SMTA) is excited to announce its first technical session of 2025, featuring industry expert Dale Lee presenting "Manufacturing by Design is the New DFM."
What to Expect:
This informative session will explore the concept of "Manufacturing by Design" (MBDF), a growing trend that emphasizes designing products with manufacturability in mind. By integrating manufacturing considerations early in the design process, companies can achieve significant benefits, including:
- Reduced costs
- Improved product quality
- Faster time-to-market
Event Details:
- Date: Thursday, January 23, 2025
- Time: 2:00 PM – 5:15 PM (US Central)
- Location: Hennepin County Technical College, Room J110, 9000 Brooklyn Blvd, Brooklyn Park, Minnesota 55445
Cost:
- SMTA Members: $20
- Non-Members: $40
- Students (with school email address): Free
Registration:
Secure your spot at this informative event by registering online.
Share on:
Suggested Items
Synopsys Teams Up with SEMI Foundation to Drive Workforce Development Initiatives in Semiconductor Industry
02/20/2025 | SEMISynopsys, Inc. and the SEMI Foundation today announced the signing of a Memorandum of Understanding (MoU) at Synopsys’ corporate headquarters in Sunnyvale, Calif. to advance workforce development within the semiconductor chip design sector.
New EDA Tool Company Embraces AI and Code
02/19/2025 | I-Connect007 Editorial TeamAt DesignCon 2025, we met with Duncan Haldane, CEO and co-founder of the EDA software company JITX, based in Berkeley and San Jose, California. This PCB design tool runs on AI and software code, which Duncan says can accelerate your design cycle by up to 25x. We asked Duncan to explain how this software came to be, how it works, and what this could mean to the future of PCB design.
Arteris Revolutionizes Semiconductor Design with FlexGen
02/19/2025 | Globe NewswireArteris, Inc., a leading provider of system IP which accelerates system-on-chip (SoC) creation, today introduced FlexGen, a revolutionary, smart network-on-chip (NoC) interconnect IP.
Altair Releases Altair HyperWorks 2025
02/19/2025 | AltairAltair, a global leader in computational intelligence, is thrilled to announce the release of Altair® HyperWorks® 2025, a best-in-class design and simulation platform for solving the world's most complex engineering challenges.
EIPC 2025 Winter Conference, Day 1: From Manufacturing to Sustainability
02/19/2025 | Pete Starkey, I-Connect007The EIPC 2025 Winter Conference, Feb. 4-5, in Luxembourg City, featured keynotes and two days conference proceedings. This is my report of the first day’s conference proceedings. The keynote session and second-day conference proceedings are reported separately.
Copyright © 2025 I-Connect007 | IPC Publishing Group Inc. All rights reserved.
Log in