Dana on Data: The Missing AI-NPI Link
Beyond Design: Key SI Considerations for High-speed PCB Design
Elementary Mr. Watson: Ensuring a Smooth Handoff From PCB Design to Fabrication
Effects of Advanced Packaging and Stackup Design
December 26, 2024 | I-Connect007 Editorial TeamEstimated reading time: 1 minute
Kris Moyer teaches several PCB design classes for IPC and Sacramento State, including advanced PCB design. His advanced design classes take on some really interesting topics, including the impact of a designer’s choice of advanced packaging upon the design of the layer stackup.
Kris shares his thoughts on the relationship between packaging and stackup, what PCB designers need to know, and why he believes, “The rules we used to live by are no longer valid.”
Kris, tell us how advanced packaging can impact stackup design. What challenges do designers need to be aware of?
Kris Moyer: With advanced packaging you usually need to use HDI or UHDI technology. This usually means sequential lamination. With sequential lamination you need to select materials that can survive multiple lamination thermal cycles.
When we were discussing advanced packaging and stackup design recently, you said, “The rules we used to live by are no longer valid.” Expand on that a little bit.
As I mentioned, your selection of materials is now further restricted by the need for materials that survive multiple lamination cycles. Additionally, since we are adding layers one at a time and need plating on all layers, not just the outer layers, the copper design is now more difficult. Also, since we are adding layers one at a time, we can now have some select instances of unbalanced Z-axis and still meet bow and twist. Furthermore, many of the ultra-thin dielectric layers used in HDI/UHDI are just resin-coated copper without any reinforcement, so CTE/FA can be more of an issue.
To read this entire conversation, which appeared in the December 2024 issue of Design007 Magazine, click here.
Share on:
Suggested Items
Just Because You Can, Doesn’t Mean You Should
03/20/2025 | Tony Plemel, Flexible Circuit TechnologiesDecisions are usually made by gathering information and differing opinions, then making the best choice based upon that information. The same process is used when designing flexible circuits and rigid-flex circuits. For example, when designing a flex circuit or rigid-flex circuit, we consider some basic factors.
Calling All Designers: The Latest Design Technology and AI
03/20/2025 | Andy Shaughnessy, Design007 MagazineAdvanced design technology and AI were in the spotlight at the annual Design Town Hall, held March 19 during IPC APEX EXPO 2025. Speakers included IPC’s Peter Tranitz, Matt Kelly, Devan Iyer, as well as a panel on the use of AI in PCB design moderated by Susan Kayesar of Siemens.
Cycuity Collaborates with SiFive and BAE Systems to Demonstrate Advanced Microelectronics Design Supply Chain Security
03/20/2025 | BUSINESS WIRECycuity, a leader in hardware security solutions, has collaborated with SiFive and BAE Systems to deliver increased, evidence-based security assurance for third-party intellectual property (IP) in a cost-effective and repeatable manner.
DuPont Interconnect Materials Enabling Advancements in Aerospace & Defense, Next-Gen Automotive, and AI
03/19/2025 | DuPontDuPont Interconnect Solutions (ICS)—a leading material solutions and systems design partner within DuPont Electronics & Industrial that addresses signal integrity and power and thermal management challenges—will showcase the benefits of its materials for printed circuit board (PCB) manufacturing and electronics assembly at IPC APEX Expo.
Lockheed Martin's AN/TPQ-53 Radar Strengthens U.S. Northern Command's Mission with Cutting-Edge Open Architecture Software
03/19/2025 | Lockheed MartinLockheed Martin has successfully integrated its AN/TPQ-53 multi-mission radar (MMR) with the Joint Task Force – Southern Border (JTF-SB) command and control systems in an operational environment, supporting U.S. Northern Command's (USNORTHCOM) southern border mission.