Fresh PCB Concepts: Key Considerations for Reliability, Performance, and Compliance in PCBs
Elementary Mr. Watson: Navigating RF—A Glide Path Approach to Design Success
Designers Notebook: Layer Stackup Planning for RF Circuit Boards
Advanced Packaging and Stackup Design: December 2024—Design007 Magazine
December 9, 2024 | I-Connect007 Editorial TeamEstimated reading time: Less than a minute
Advanced Packaging and Stackup Design
As advanced packaging moves further into the mainstream of PCB design, more PCB designers and design engineers are realizing that this isn’t a plug-and-play technology. As we see in this issue, advanced packaging can have an impact on the entire design—the stackup in particular.
For the December 2024 issue of Design007 Magazine, we asked our expert contributors to discuss the impact of advanced packaging on stackup design—from SI and DFM challenges through the variety of material tradeoffs that designers must contend with in the arena of HDI and UHDI. And with a little research, planning, and collaboration with the fabricator, any seasoned PCB designer can utilize advanced packaging.
Share on:
Suggested Items
Baker Hughes' Waygate Unveils Nanotom HR for Advanced Inspection
05/06/2025 | Baker HughesWaygate Technologies, a Baker Hughes business and global leader in nondestructive testing (NDT) solutions for industrial inspection, unveiled its new extremely high-resolution computed tomography (CT) system, Phoenix Nanotom® HR (High Resolution) at the Control 2025 show in Stuttgart, Germany.
Libra Industries Boosts SMT and Electronics Manufacturing Capabilities in Dallas, Texas
05/06/2025 | Libra IndustriesLibra Industries is excited to announce the latest upgrades to its surface mount technology (SMT) capabilities at its Dallas, Texas facility.
Koh Young Invites You to the 2025 IEEE Electronic Components and Technology Conference
05/06/2025 | Koh YoungKoh Young, the industry leader in True3D™ measurement-based inspection solutions, invites you to join us at the 2025 IEEE Electronic Components and Technology Conference (ECTC), taking place May 27–30, 2025, at the Gaylord Texan Resort & Convention Center in Grapevine, Texas
Happy’s Tech Talk #38: Novel Metallization for UHDI
05/07/2025 | Happy Holden -- Column: Happy’s Tech TalkI have been involved in high-density electronics substrates since 1970 when I joined Hewlett-Packard’s RF semiconductor group after college. Figure 1 shows the difference between trace/space lithography for substrates and silicon starting in 1970. My projects involved sapphire circuits for RF devices, but the figure displays the state of PCBs and integrated CMOS circuits and their packaging, not discreet RF devices. Even then, semiconductors were 50X higher density.
SEMICON Europa 2025 Call for Abstracts Opens for Advanced Packaging Conference and MEMS & Imaging Summit
05/05/2025 | SEMISEMI Europe announced the opening of the call for abstracts for SEMICON Europa 2025, to be held November 18-21 at Messe München in Munich, Germany. Selected speakers will share their expertise at the Advanced Packaging Conference (APC), MEMS & Imaging Sensors Summit, and during presentations on the show floor.