The Shaughnessy Report: Always With the Negative Waves
Connect the Dots: Stop Killing Your Yield—The Hidden Cost of Design Oversights
Global PCB Connections: A Field Engineer’s Perspective on the Top 10 Trends to Watch
Advanced Packaging and Stackup Design: December 2024—Design007 Magazine
December 9, 2024 | I-Connect007 Editorial TeamEstimated reading time: Less than a minute
Advanced Packaging and Stackup Design
As advanced packaging moves further into the mainstream of PCB design, more PCB designers and design engineers are realizing that this isn’t a plug-and-play technology. As we see in this issue, advanced packaging can have an impact on the entire design—the stackup in particular.
For the December 2024 issue of Design007 Magazine, we asked our expert contributors to discuss the impact of advanced packaging on stackup design—from SI and DFM challenges through the variety of material tradeoffs that designers must contend with in the arena of HDI and UHDI. And with a little research, planning, and collaboration with the fabricator, any seasoned PCB designer can utilize advanced packaging.
Share on:
Suggested Items
Saki’s AXI Upgrade Enhances Image Noise Reduction for Power Modules, Enabling Sharper, More Accurate Inspections
04/11/2025 | Saki CorporationSaki Corporation, an innovator in the field of automated optical and X-ray inspection equipment, announces significant enhancements to the image processing capabilities of its 3Xi-M200 X-ray Automated Inspection (AXI) system.
Saildrone Announces European Entity Based in Denmark
04/11/2025 | BUSINESS WIRESaildrone, the global leader in maritime autonomy, today announced it is establishing a European subsidiary in Denmark, to address the urgent need for maritime domain awareness in European waters.
Real Time with... IPC APEX EXPO 2025: Advancements for Flexible Circuit Technologies
04/11/2025 | Real Time with...IPC APEX EXPOMark Finstad and Chris Clark from Flexible Circuit Technologies discuss their new marketing campaign for catheter circuits, featuring larger formats and advanced specifications. They explain the development of in-house materials for high-density circuits, enhancing cost competitiveness. They highlight the opening of a new facility in China for advanced assembly services, along with focused training sessions to fill industry education gaps and promote early customer engagement for better project outcomes.
DuPont Ikonic 9000 CMP Pads Win 2025 Edison Award
04/09/2025 | DuPontDuPont announced that its Ikonic™ 9000 series of polishing pads for chemical mechanical planarization (CMP) was awarded a 2025 Bronze Edison Award™ in the AI-driven advancements category.
Incap US Invests in Advanced SMT Technology
04/09/2025 | IncapIncap US invested approximately USD 2 million (EUR 1.82 million) in advanced SMT (surface-mount technology) production equipment to expand its production capacity.