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Current IssueIt's Show Time!
In this month’s issue of PCB007 Magazine we reimagine the possibilities featuring stories all about IPC APEX EXPO 2025—covering what to look forward to, and what you don’t want to miss.
Fueling the Workforce Pipeline
We take a hard look at fueling the workforce pipeline, specifically at the early introduction of manufacturing concepts and business to young people in this issue of PCB007 Magazine.
Inner Layer Precision & Yields
In this issue, we examine the critical nature of building precisions into your inner layers and assessing their pass/fail status as early as possible. Whether it’s using automation to cut down on handling issues, identifying defects earlier, or replacing an old line...
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iNEMI Connector Footprint Tolerance End-of-Project Webinar
October 24, 2024 | iNEMIEstimated reading time: Less than a minute
iNEMI’s PCB Connector Footprint Tolerance Project investigated industry capability, risks and mitigation strategies associated with high-bandwidth I/O connector footprints. As bandwidth continues to double every three years, the reduction in connector pitch imposes stringent design requirements on PCB fabrication processes. The project team aimed to provide product designers with the information necessary to ensure predictable quality levels when using high-bandwidth connectors. A literature review, along with team experience, helped identify potential risks and create a PCB industry survey to assess supplier capabilities for appropriate quality mitigation.
Join us for this end-of-project webinar where we will review survey results and highlight areas of expectations and gaps between PCB fabricators and connector manufacturers. Additionally, the team will present recommendations for quality assessment and dimension control.
Registration
This webinar is open to industry; advance registration is required, click here.
Monday, October 28, 2024
11:00 a.m. – 12:00 p.m. EDT (Americas)
4:00-5:00 p.m. CET (Europe)
Suggested Items
Summit Interconnect Welcomes Leo LaCroix as Vice President of Aerospace & Defense Operations
02/21/2025 | Summit Interconnect, Inc.Summit Interconnect, a leading provider of advanced printed circuit board (PCB) solutions, is pleased to announce that Leo LaCroix has joined the company as Vice President of Aerospace & Defense Operations. In this role, LaCroix will oversee operational strategy, customer engagement, and manufacturing excellence for Summit’s aerospace and defense-focused facilities, driving continued growth and innovation in the sector.
North American PCB Industry Sales Up 19.9% in January
02/20/2025 | IPCIPC announced today the January 2025 findings from its North American Printed Circuit Board (PCB) Statistical Program. The book-to-bill ratio stands at 1.24.
The Resurgence of European PCB Manufacturing: A Strategic Advantage
02/20/2025 | Jordan Labbe, ICAPE GroupThe global electronics landscape is undergoing a significant transformation. Driven by a confluence of factors, including geopolitical instability, supply chain disruptions, and a growing emphasis on agility and localized production, a renewed focus on European PCB manufacturing is emerging. This resurgence is not merely a trend; it represents a strategic advantage for companies seeking to navigate the complexities of the modern electronics market with multiple sourcing options, outside of China.
Are Domestic Assemblers Ready for the Next Level of Electronics Miniaturization?
02/19/2025 | Chrys Shea, SHEA Engineering ServicesUHDI technology is more than another evolutionary level of miniaturization. It’s a fundamental change in how we create circuit boards, on a scale potentially as impactful as the transition from through-hole to surface mount was 40 years ago.
EIPC 2025 Winter Conference, Day 1: From Manufacturing to Sustainability
02/19/2025 | Pete Starkey, I-Connect007The EIPC 2025 Winter Conference, Feb. 4-5, in Luxembourg City, featured keynotes and two days conference proceedings. This is my report of the first day’s conference proceedings. The keynote session and second-day conference proceedings are reported separately.