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Marcy’s Musings: Destination Metallization

To reach your intended destination, you must have some form of pathway or route upon which to travel. It is much the same with the metallized traces and features on a printed circuit board. They are how electrical signals and power are carried from one point to another in an electronic device. Copper is the most prevalent metal conductor, but other metals are also used to a lesser degree, including gold, silver, tin, and palladium.

Not much has changed in the plating manufacturing process in the past five decades. However, as miniaturization and the development of advanced packaging accelerate within and around the sphere of PCB fabrication, alternative plating metals and newer plating processes have been introduced. Necessity is the mother of invention, after all. These newer processes bring up a lot of interest and discussion around alternate metallization and process technologies, where we invariably ask, “Must I, and if so, when?” The path is clearer with this technology than with others. But the overarching message is consistent with a greater theme throughout all of electronics manufacturing: Business-as-usual today will not necessarily look like business-as-usual in the ensuing decades.

In thef October 2024 issue of PCB007 Magazine, we examine alternate metallization methods, including MacDermid Alpha’s graphite technology and Uyemura’s RAIG technology. John Johnson of American Standard Circuits discusses liquid metal ink as a process technology alternative. Dyconex’s Dr. Evelyne Parmentier explains sputtering technology and alternative metal elements from the R&D standpoint. I’ve also included Mike Carano’s comprehensive overview of direct metallization technology. (Stay tuned next month as the discussion continues with a looking-back-to-look-forward feature discussing the merits of tin nickel plating.)

Also in this issue, Happy Holden and Don Ball talk about root cause analysis and fixing problems, an essential reality of any manufacturing business and something that must be carefully approached and executed. Jesse Ziomek talks about the new technology offerings at DIS for customers. Dan Feinberg introduces a new article series highlighting award recipients of the IPC Hall of Fame. TTM takes us through its new, state-of-the-art facility in Malaysia, and Shane Whiteside of PCBAA elevates the important issue of bringing manufacturing back to the United States in a meaningful way, and what the CHIPS Act does and does not do for our part of the supply chain.

So, grab a pumpkin spice latte, and let’s get into the October issue.

This column originally appeared in the October 2024 issue of PCB007 Magazine.