Beyond Design: High-speed Rules of Thumb
Global PCB Connections: A Technical Overview of Long-flex Printed Circuit Boards
The Shaughnessy Report: A Handy Look at Rules of Thumb
Introducing the Ultra HDI Learning Pavilion at SMTA International 2024
October 7, 2024 | SMTAEstimated reading time: 2 minutes
The SMTA is thrilled to announce the launch of the Ultra HDI (UHDI) Learning Pavilion, a first-of-its-kind experience dedicated to advancing Ultra-High Density Interconnect technology. Taking place in booth #2753 during SMTA International, October 22-24, 2024 in Rosemont, Illinois, this interactive and educational pavilion is FREE and open to all attendees.
The UHDI Pavilion will serve as the hub for industry professionals eager to dive into the world of UHDI, where groundbreaking advancements in miniaturization are pushing the boundaries of electronics manufacturing. Attendees can explore a packed schedule of technical sessions led by experts from across the supply chain, focusing on UHDI Test Board design, fabrication materials, assembly processes, and solutions to address the ongoing challenges of miniaturization.
Key Highlights of the UHDI Pavilion:
Technical Sessions:
A diverse range of sessions will cover essential topics such as UHDI Test Board Design, Ultra HDI Demand, Fabrication, Materials, Ultra-Fine Solder Powders, Stencil, Inspection and Component Placement. Industry experts will share their insights and innovations.
"Lab to Fab" Working Session:
On Wednesday, October 23 from 3:00 to 4:00 PM, join Elliott Fowler of Sandia National Laboratories, Bill Capen, Honeywell FM&T and Chrys Shea for the "Lab to Fab" working session. This session is designed to break down silos and foster collaboration across the supply chain, accelerating the transition from concept to production.
Networking Opportunities:
The UHDI Pavilion will also feature dedicated networking time on Thursday, October 24, allowing attendees to connect with key players in the UHDI space and explore potential partnerships.
Ultra HDI Pavilion Schedule Highlights:
Wednesday, October 23
- 10:00-10:20: Chrys Shea, Shea Engineering, "UHDI Test Board Design and Reasoning"
- 10:30-11:15: Guest Speaker, "Demand and Why We Need UHDI"
- 11:30-11:50: Paul Cooke, AGC, "Fabrication Materials for UHDI"
- 12:00-12:20: John Johnson, ASC, "Fabrication Processes for UHDI"
- 12:30-12:50: Greg Smith, Blue Ring, "Stencil"
- 1:00-1:20: Gayle Towell, AIM Solder, "Materials (Ultra Fine Powders)"
- 1:30-1:50: Brent Fischthal, Koh Young America, "Inspection"
- 2:00-2:20: Guest Speaker, "Component Placement"
- 2:30-2:50: Bill Capen, Honeywell FM&T, "Cleaning and SIR"
- 3:00-4:00: Elliott Fowler, Sandia National Laboratories, Bill Capen, Honeywell FM&T and Chrys Shea, Shea Engineering, "Lab to Fab - Working Session"
Thursday, October 24
- 10:00-10:30: Paul Cooke, AGC, "Additive Fabrication Options: What’s the Big Deal?"
- 11:00-11:30: John Johnson, ASC, "It Depends: PCB Design Trade-Offs"
- 11:30-1:00: Networking Session
Share on:
Suggested Items
UHDI Fundamentals: UHDI Bleeding-edge Manufacturing Applications, Part 1
11/14/2024 | Anaya Vardya, American Standard CircuitsLast month, I talked about ultra high definition interconnect (UHDI) in relation to entertainment applications. This month, I will explain bleeding-edge UHDI applications in manufacturing, which are revolutionizing the industry by enabling ultra-precise visual data transmission, high-speed communication between devices, and real-time monitoring. These UHDI technologies help manufacturers achieve higher efficiency, better quality control, and greater automation. Following are some leading-edge manufacturing applications of UHDI in manufacturing.
UHDI Fundamentals: ‘UHDI’ Bleeding-edge Entertainment Applications, Part 1
10/10/2024 | Anaya Vardya, American Standard CircuitsAs soon as we cross below the 1-mil (0.001") line width threshold, we need to stop talking in terms of mils and ounces and begin talking in terms of microns. For reference, a 3-mil trace is 75 microns, so a 1-mil trace is 25 microns. In general terms, ultra high density interconnect refers to line and spaces on a printed circuit board that are sub-25 micron. In the context of this article, ultra high-definition interconnect (UHDI) refers to the technology and infrastructure used to transmit and connect ultra high-definition signals, typically 4K, 8K, or even higher resolutions, across devices like displays, cameras, servers, and processors.
UHDI Fundamentals: UHDI Applications for Aerospace
08/13/2024 | Anaya Vardya, American Standard CircuitsUltra high density interconnect (UHDI) technology refers to advanced manufacturing processes used to create extremely compact and highly efficient electronic circuits at the sub-1-mil line and space level. In aerospace applications, UHDI is crucial due to the stringent requirements for weight, reliability, and performance in a challenging environment.
Matrix Introduces Specialty Process Equipment for the UHDI and IC Substrate Market
07/30/2024 | Matrix ElectronicsGlobal expansion for semiconductor chips and the resulting requirement for UHDI and IC Substrate packaging has led to increased investments in PCB manufacturing capacity to support this growth. UHDI and IC packaging manufacturing requires new equipment dedicated to the specification and quality requirements for these product lines.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
07/19/2024 | Andy Shaughnessy, PCBDesign007Are you ready for the weekend? Fin de semana? I think we all are! In this week’s roundup, we have one article on what it takes to thrive in the industry today, as well as an interview that discusses one student’s drive to succeed as a PCB designer. We also have an article by our newest columnist, Tom Yang, who introduces us to his family-owned PCB company. Columnist Hanna Grace brings us an interview with her mentor, and Anaya Vardya continues his UHDI coverage with an article that explains UHDI’s use in the RF/microwave arena.