-
-
News
News Highlights
- Books
Featured Books
- design007 Magazine
Latest Issues
Current IssueLearning to Speak ‘Fab’
Our expert contributors clear up many of the miscommunication problems between PCB designers and their fab and assembly stakeholders. As you will see, a little extra planning early in the design cycle can go a long way toward maintaining open lines of communication with the fab and assembly folks.
Training New Designers
Where will we find the next generation of PCB designers and design engineers? Once we locate them, how will we train and educate them? What will PCB designers of the future need to master to deal with tomorrow’s technology?
The Designer of the Future
Our expert contributors peer into their crystal balls and offer their thoughts on the designers and design engineers of tomorrow, and what their jobs will look like.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - design007 Magazine
EMA Webinar: Next Generation MCAD/ECAD for SOLIDWORKS
May 9, 2024 | EMA Design AutomationEstimated reading time: 1 minute

Experiencing challenges with MCAD/ECAD collaboration? Do update and revisions take too long? Are you finding integration issues too late in the design process? Does the fidelity of the ECAD data you receive prevent you from building a full digital prototype of your design before manufacture?
If you answered yes to any of these questions you are not alone. MCAD/ECAD is a significant challenge and pinch point in the overall design process and with increasing product complexity and compressed schedules the challenge is only getting more severe. Fortunately, Cadence & Dassault have partnered to help design teams solve these problems through enhanced integration between the MCAD and ECAD design software.
Learn how the MCAD and ECAD experts at Hawk Ridge and EMA can help you solve your MCAD/ECAD integration challenges with this unique collaboration environment.
What You Will Learn:
- Common challenges in ECAD/MCAD collaboration and how to overcome them.
- How Cadence & Dassault have partnered to solve these challenges.
- Importance of native integration for MCAD design continuity
- How to effectively collaborate with ECAD on design choices and libraries
- Preview of next generation 3DX cloud connector
May 14th, 2024 @ 2:00pm ET. Register now in the events section of ema-eda.com.
Suggested Items
Flex Opens New Product Introduction (NPI) Center Serving Healthcare Customers in North America
03/25/2025 | FlexFlex announced the opening of its new product introduction (NPI) center near Boston, Mass., serving healthcare customers.
Airbus Advances Key Technologies for Next-Generation Single-Aisle Aircraft
03/25/2025 | AirbusDuring the 2025 Airbus Summit, Airbus provided an update on its roadmap to pioneer the future of commercial aviation in the decades to come.
New Power Management Chips from TI Maximize Protection, Density and Efficiency for Modern Data Centers
03/24/2025 | Texas InstrumentsTexas Instruments (TI) debuted new power-management chips to support the rapidly growing power needs of modern data centers. As the adoption of high-performance computing and artificial intelligence (AI) increases, data centers require more power-dense and efficient solutions.
Empowering the Future of Advanced Computing and Connectivity: DuPont Unveils Innovative Advanced Circuit Materials in Shanghai
03/24/2025 | DuPontDuPont will showcase how we are shaping the next generation of electronics at the International Electronic Circuits (Shanghai) Exhibition 2025.
Zuken Joins IBM Research AI Hardware Center to Develop Next-Generation AI Hardware Solutions
03/24/2025 | ZukenZuken Inc. announced an agreement with IBM to join the IBM Research AI Hardware Center as a commercial member. The IBM Research AI Hardware Center, a global research hub headquartered at the Albany NanoTech Complex in Albany, NY, aims to develop next-generation chips and systems, including advanced semiconductor packaging, that support the processing power and unprecedented speed that AI requires.