Microchip Technology Expands Partnership with TSMC to Strengthen Semiconductor Manufacturing Capacity
April 8, 2024 | Microchip Technology Inc.Estimated reading time: 1 minute
Microchip Technology announced it has expanded its partnership with TSMC, the world’s leading semiconductor foundry, to enable a specialized 40 nm manufacturing capacity at Japan Advanced Semiconductor Manufacturing, Inc. (JASM), TSMC’s majority-owned manufacturing subsidiary in Kumamoto Prefecture, Japan. This partnership is part of Microchip’s ongoing strategy to build resiliency in its supply chain. Other initiatives include investing in additional technology to boost internal manufacturing capabilities and capacity, as well as establishing more geographical diversity and redundancy with wafer fab, foundry, assembly, test and OSAT partners.
“Microchip’s reputation for providing responsible and reliable supply management is enhanced with this new TSMC manufacturing path,” said Michael Finley, Microchip senior vice president of worldwide manufacturing and technology. “Customers can have confidence when designing our products into their applications and platforms, with the support of resilient and robust manufacturing capabilities.”
The wafer capacity supply from JASM further strengthens Microchip’s ability to serve a broad base of global customers in a variety of markets including automotive, industrial and networking applications.
“This initiative with Microchip is further proof of TSMC’s commitment to supporting our customers’ long-term growth and innovation,” said Rose Castanares, senior vice president of business management at TSMC North America. “Our expanded collaboration with Microchip will ensure that as leading technologies continue to develop, so will our collective ability to manufacture and deliver those capabilities to global customers when they are needed.”
The TSMC partnership and JASM capacity adds more assurance to the manufacturing landscape, helping reduce Microchip’s potential of disrupted supply by offsetting external factors such as frequently changing business conditions and natural disasters.
Testimonial
"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."
Julia McCaffrey - NCAB GroupSuggested Items
Pentalogix Launches ViewMate Essentials to Ensure PCB Designs are Manufacturing-Ready
09/03/2025 | PentaLogixPentalogix, Inc., a leader in PCB design solutions, announced the launch of ViewMate Essentials, an advanced CAM package designed to enhance the workflow of PCB designers. Available starting September 2nd, 2025, ViewMate Essentials enables designers to view, edit, and manage PCB manufacturing files with exceptional precision, facilitating seamless collaboration with PCB fabricators and assemblers.
SRXGlobal Celebrates Inauguration of Johor Bahru Facility Expansion and Modernization
09/03/2025 | BUSINESS WIRESRXGlobal, a Scanfil company, is proud to announce the expansion and modernization of its facility in Johor Bahru, Malaysia.
Benchmark Announces CEO Succession Plan
09/03/2025 | Benchmark Electronics Inc.Benchmark Electronics, Inc., a worldwide provider of innovative product design, engineering services, technology solutions, and advanced manufacturing services, announced President and Chief Executive Officer Jeff Benck’s intention to retire effective March 31, 2026.
The Global Electronics Association Hosts Successful WorksAsia-AI and Factory of the Future Technical Seminar
09/03/2025 | Global Electronics AssociationOn August 22, 2025, the Global Electronics Association hosted the successful WorksAsia-AI and Factory of the Future Technical Seminar during the exhibition Automation Taipei 2025. The seminar brought together 81 representatives from 58 companies, focusing on the latest applications of AI in smart factories and unveiling four key directions that will drive the electronics industry’s transition toward intelligence and sustainability.
ASMPT Joins 'JOINT3' Consortium to Develop Next-Generation Semiconductor Packaging
09/03/2025 | ASMPTASMPT Limited (ASMPT), a leading global supplier of hardware and software solutions for the manufacture of semiconductors and electronics, announced its participation in the "JOINT3" consortium to develop next-generation semiconductor packaging.