Microchip Technology Expands Partnership with TSMC to Strengthen Semiconductor Manufacturing Capacity
April 8, 2024 | Microchip Technology Inc.Estimated reading time: 1 minute
Microchip Technology announced it has expanded its partnership with TSMC, the world’s leading semiconductor foundry, to enable a specialized 40 nm manufacturing capacity at Japan Advanced Semiconductor Manufacturing, Inc. (JASM), TSMC’s majority-owned manufacturing subsidiary in Kumamoto Prefecture, Japan. This partnership is part of Microchip’s ongoing strategy to build resiliency in its supply chain. Other initiatives include investing in additional technology to boost internal manufacturing capabilities and capacity, as well as establishing more geographical diversity and redundancy with wafer fab, foundry, assembly, test and OSAT partners.
“Microchip’s reputation for providing responsible and reliable supply management is enhanced with this new TSMC manufacturing path,” said Michael Finley, Microchip senior vice president of worldwide manufacturing and technology. “Customers can have confidence when designing our products into their applications and platforms, with the support of resilient and robust manufacturing capabilities.”
The wafer capacity supply from JASM further strengthens Microchip’s ability to serve a broad base of global customers in a variety of markets including automotive, industrial and networking applications.
“This initiative with Microchip is further proof of TSMC’s commitment to supporting our customers’ long-term growth and innovation,” said Rose Castanares, senior vice president of business management at TSMC North America. “Our expanded collaboration with Microchip will ensure that as leading technologies continue to develop, so will our collective ability to manufacture and deliver those capabilities to global customers when they are needed.”
The TSMC partnership and JASM capacity adds more assurance to the manufacturing landscape, helping reduce Microchip’s potential of disrupted supply by offsetting external factors such as frequently changing business conditions and natural disasters.
Suggested Items
Amtech Boosts Capabilities with New SMT Lines and Advanced Batch Washing System
04/25/2025 | AmtechAmtech Electrocircuits, a leading provider of manufacturing solutions, has announced a major upgrade to its production capabilities with the installation of multiple new SMT (Surface Mount Technology) lines and a state-of-the-art batch washing system.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
04/25/2025 | Nolan Johnson, I-Connect007I’m highlighting a discussion on the positive potential coming from the recent changes in global trade policy—from IPC’s Government Relations team, and from TTM CEO Tom Edman. In the realm of designers and purchasers realm, there’s news from Screaming Circuits and ASC/Sunstone Circuits to share. Finally, additive manufacturing and the release of CFX 2.0 highlight just some of the news coming to the shop floor as well.
LITEON, Elephantech Deepen Partnership to Further Drive Innovation and End-to-End Sustainability
04/24/2025 | LITEON TechnologyLITEON Technology has signed a second Memorandum of Understanding (MoU) with Elephantech, deepening their strategic partnership in advancing green Printed Circuit Boards (PCB) manufacturing. Announced on Earth Day (April 22), the renewed collaboration highlights their joint commitment to achieving net-zero carbon emissions.
TRI at SMTA Wisconsin Expo 2025
04/24/2025 | TRITest Research, Inc. (TRI), the leading test and inspection systems provider for the electronics manufacturing industry, will join the SMTA Wisconsin Expo 2025.
Murata, QuantumScape Start to Explore a Collaboration for Manufacturing of Ceramics
04/24/2025 | MurataMurata Manufacturing Co., Ltd. and QuantumScape Corporation have entered into the first phase of an agreement to explore a collaboration for high-volume manufacturing of ceramic film for QuantumScape’s solid-state battery technology.