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Qnity Launches Optivision Max CMP Pad Family for Next-Gen Semiconductor Manufacturing

06/10/2026 | BUSINESS WIRE
Qnity Electronics, Inc., a premier technology solutions leader across the semiconductor value chain, announced the expansion of its offerings for chemical mechanical planarization (CMP) with the introduction of Optivision™ Max polishing pads.

NUBURU Expands Defense Platform with Laser Arm Targeting Directed-Energy and Counter-UAS Markets

06/05/2026 | BUSINESS WIRE
The Agreement has been signed by NUBURU, Inc., with NUBURU intending to implement the definitive investment and industrial cooperation through Lyocon S.r.l., its Italian laser-engineering and manufacturing subsidiary, as the designated NUBURU group entity.

Zhen Ding Technology Sets Record High Revenue in May 2026

06/05/2026 | Zhen Ding Technology
Zhen Ding Technology Holding Limited, a global leading PCB manufacturer,  reported May 2026 revenue of NT$16,201 million, up 37.40% YoY and 6.61% MoM, again setting a record high for the same period in the company's history

Dow Launches DOWSIL TC-3120 Thermal Gel for Optimum Heat Transfer for Optical Modules, Dense Electronics and High-speed Data Applications

06/01/2026 | Dow
Dow has announced the launch of DOWSIL™ TC-3120 Thermal Gel, a silicone-based material designed to optimize heat transfers and provide optical-grade cleanliness. It has the highest thermal conductivity (~12 W/m·K) among Dow’s commercially available silicone gels and is designed to minimize oil bleeding and condensed outgassing – contaminants that can reduce the reliability of optics and electronics.

ARGUS Interception & Ouster Partner to Advance Counter-UAS Systems with Digital Lidar

05/26/2026 | BUSINESS WIRE
Ouster, Inc., a leader in sensing and perception for Physical AI, and ARGUS Interception GmbH, a pioneer in net-based counter-UAS interception systems, announced a strategic agreement under which ARGUS Interception will equip its A1-Falke® net-based interceptors with Ouster digital lidar.
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