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Qualcomm Propels Global Expansion of 5G RedCap with Snapdragon X35 5G Modem-RF System
November 8, 2023 | Qualcomm Technologies, Inc.Estimated reading time: 1 minute
As the world’s first announced commercial release 17 5G RedCap modem-RF system, the Snapdragon® X35 5G Modem-RF System continues to fuel the expansion of the 5G ecosystem by enabling global mobile network operators and OEMs to enable new devices, form factors, and experiences.
With strong customer interest in the industry-leading Snapdragon X35 5G Modem-RF System for 5G RedCap devices, Qualcomm Technologies, Inc. is extending its wireless leadership – spanning modem, RF transceiver, RF front-end and antenna modules – into a fast-growing opportunity for 5G mobile operators. The Snapdragon X35 brings a new class of 5G that bridges the complexity gap between high-speed mobile broadband devices and extremely low-bandwidth internet of things (IoT) devices. RedCap will enable smaller and more cost-efficient 5G devices and provide longer battery life, thanks to their reduced complexity.
Numerous mobile industry leaders around the world have taken notice and are working with Qualcomm Technologies, Inc. to develop and deploy devices powered by Snapdragon X35.
“5G RedCap is one of the primary pillars of 5G Advanced and is key to the evolution of 5G. It bridges the capability and complexity gap between the extremes in 5G today, and can enable a broader set of devices and services as well as enhance system performance and efficiency,” said Gautam Sheoran, vice president and general manager, wireless and broadband communications, Qualcomm Technologies, Inc. “We’re pleased to deepen our collaboration with global mobile operators and OEMs to advance the 5G ecosystem, enabling a new and wide range of premium- and entry-level use cases.”
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Review: PCEA Orange County Summer Meeting
08/06/2025 | Dan Feinberg, Technology Editor, I-Connect007The Printed Circuit Engineering Association (PCEA) represents a community of engineers, designers, and industry influencers dedicated to the advancement of PCB technology, design, and manufacturing, and the growth and knowledge of its membership. PCEA regularly hosts events to share the latest developments, best practices, and visions for the future of electronic design and manufacturing. The Orange County chapter seems to be one of the largest and most active ones and I was invited to attend the latest chapter event on July 24 in Costa Mesa, California.
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Solving the Toughest BGA Challenges in Electronics
07/30/2025 | Nash Bell, BEST Inc.Since the late 1990s, ball grid array (BGA) packages have emerged as a preferred package style for electronic devices. Compared with high-density ultra-fine pitch quad flat packs (QFPs), BGA packages significantly reduce the required footprint on printed circuit boards (PCBs) by approximately 50%.