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Why is it so difficult to create the ideal data package? Many of these simple errors can be alleviated by paying attention to detail—and knowing what issues to look out for. So, this month, our experts weigh in on the best practices for creating the ideal design data package for your design.
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iNEMI & ZESTRON Workshop: Advanced Packaging and its Impact on mm/Wave Applications
October 18, 2023 | iNEMIEstimated reading time: Less than a minute
A workshop sponsored by iNEMI and ZESTRON Corporation will be held on November 7, 2023 at 9:00 a.m.-5:00 p.m.
This full-day workshop brings together industry-based and academic researchers to talk about the challenges of advanced packaging and its intersection with high-frequency (mmWave) materials. The morning session focuses on heterogeneous integration and the latest materials and processes for electronics packaging, and the afternoon session will cover highlights from the 5G/6G mmWave Materials and Electrical Test Technology Roadmap (5G/6G MAESTRO). Part of the NIST Advanced Manufacturing Technology (MfgTech) Roadmap program, MAESTRO is focused on creating a foundation of knowledge and expertise in the U.S. to support the development and manufacture of leading edge 5G and 6G products.
The workshop will be hosted by ZESTRON Americas in their Manassas, Virginia, facility and features speakers from
- Ajinomoto USA
- Florida International University
- Georgia Institute of Technology
- Intel
- iNEMI
- NIST
- Mosaic
- Penn State University
- SunRay Scientific
- ZESTRON
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