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Amtech Systems Books Large Repeat Order Driven by EV Growth
December 1, 2022 | Amtech Systems, Inc.Estimated reading time: 1 minute

Amtech Systems, Inc., a manufacturer of capital equipment, including thermal processing and wafer polishing, and related consumables used in fabricating semiconductor devices, such as silicon carbide (SiC) and silicon power devices, analog and discrete devices, electronic assemblies and light-emitting diodes (LEDs), announced the receipt of an order for 20 controlled atmosphere furnaces for production of Direct Bond Copper (DBC) substrates.
The repeat order was received by Amtech division, BTU International, for 20 controlled atmosphere furnaces for delivery starting in the second half of fiscal 2023. These continuous furnaces will be used for the volume production of DBC substrates, a process which requires extreme control of thermal uniformity and oxidation atmosphere. The furnaces will be produced at BTU’s factory in the USA and shipped to customer locations in Asia. The DBC substrates produced by these furnaces will be used for power device modules intended for electric vehicles (EV).
“We are seeing customer demand related to the scale-up of electric vehicles across all of our divisions,” said Michael Whang, CEO of Amtech Systems. “DBC is a technology uniquely suited for heat dissipation in power modules -- and BTU’s systems have the superior process control to produce DBC substrates reliably and at scale,” added Whang.
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Rachael Temple - AlltematedSuggested Items
OKI Launches Rigid-Flex PCBs with Embedded Copper Coins Featuring Improved Heat Dissipation for Space Equipment Applications
07/29/2025 | BUSINESS WIREOKI Circuit Technology, the OKI Group’s printed circuit board (PCB) business company, has developed rigid-flex PCBs with embedded copper coins that offer improved heat dissipation for use in rockets and satellite-mounted equipment operating in vacuum environments.
Designers Notebook: Basic PCB Planning Criteria—Establishing Design Constraints
07/22/2025 | Vern Solberg -- Column: Designer's NotebookPrinted circuit board development flows more smoothly when all critical issues are predefined and understood from the start. As a basic planning strategy, the designer must first consider the product performance criteria, then determine the specific industry standards or specifications that the product must meet. Planning also includes a review of all significant issues that may affect the product’s manufacture, performance, reliability, overall quality, and safety.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
07/18/2025 | Nolan Johnson, I-Connect007It may be the middle of the summer, but the news doesn’t quit, and there’s plenty to talk about this week, whether you’re talking technical or on a global scale. When I have to choose six items instead of my regular five, you know it’s good. I start by highlighting my interview with Martyn Gaudion on his latest book, share some concerning tariff news, follow that up with some promising (and not-so-promising) investments, and feature a paper from last January’s inaugural Pan-European Design Conference.
Elephantech Launches World’s Smallest-Class Copper Nanofiller
07/17/2025 | ElephantechJapanese deep-tech startup Elephantech has launched its cutting-edge 15 nm class copper nanofiller – the smallest class available globally. This breakthrough makes Elephantech one of the first companies in the world to provide such advanced material for commercial use.
Copper Price Surge Raises Alarms for Electronics
07/15/2025 | Global Electronics Association Advocacy and Government Relations TeamThe copper market is experiencing major turbulence in the wake of U.S. President Donald Trump’s announcement of a 50% tariff on imported copper effective Aug. 1. Recent news reports, including from the New York Times, sent U.S. copper futures soaring to record highs, climbing nearly 13% in a single day as manufacturers braced for supply shocks and surging costs.