Dan’s Biz Bookshelf: ‘Believe in Better'
The Big Picture: Our Big ‘Why’ in the Age of AI
The Chemical Connection: Through-glass Vias in Glass Substrates
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Trouble in Your Tank: Via Hole Filling and Plugging, Part 2
In my previous column, I presented several options with which to accomplish blind and through-hole via filling. In this edition of “Trouble in Your Tank,” I will discuss filling blind vias and through-holes with polymeric pastes.
Via Fill Paste
Often, the phrase “plugging paste” is used to describe the method and material of completely filling blind vias and through-holes. In general, paste filling material selection is at the request of the end user and indicated for a number of reasons. It has been my experience that major OEMs are driving the industry to migrate to the high-Tg/low-CTE plugging paste formulations for high-density applications. In addition, these formulations are of a non-conductive nature that provides a high-quality plugged via that is cost-effective. Limitations abound depending on PCB thickness, via diameter, and paste properties.
To read this entire column, which appeared in the October issue of PCB007 Magazine, click here.
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More Columns from Trouble in Your Tank
Trouble in Your Tank: Yield Improvement and ReliabilityTrouble in Your Tank: Causes of Plating Voids, Pre-electroless Copper
Trouble in Your Tank: Organic Addition Agents in Electrolytic Copper Plating
Trouble in Your Tank: Interconnect Defect—The Three Degrees of Separation
Trouble in Your Tank: Things You Can Do for Better Wet Process Control
Trouble in Your Tank: Processes to Support IC Substrates and Advanced Packaging, Part 5
Trouble in Your Tank: Materials for PWB Fabrication—Drillability and Metallization
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