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Suggested Items

Knocking Down the Bone Pile: Precision Milling of Underfilled SMT Components

05/13/2026 | Nash Bell -- Column: Knocking Down the Bone Pile
Underfill is a polymeric material used to fill the gap between a printed circuit board and the underside of surface-mount area-array packages such as BGA, QFP, and QFN devices, thereby surrounding and protecting the solder interconnections. This material increases the component's reliability when subjected to mechanical impacts and shocks by distributing forces. 

Connect the Dots: Designing for the Future of Manufacturing Reality—Surface Finish

05/07/2026 | Matt Stevenson -- Column: Connect the Dots
When designing the complex boards that many electronic devices require to operate, designers should consider manufacturability at every step. This is my last article focused on designing for the always-evolving manufacturing reality. Choosing the right surface finish has always been important. If you are creating intricate designs with a wide variety of components, like for an ultra-high density interconnect (UHDI) board, surface finish is a critical last step.

Strong AI Demand vs. Weak Consumer Segment Creates Pricing Divergence Among MLCC Suppliers

04/28/2026 | TrendForce
TrendForce’s latest research shows that the MLCC market in 2Q26 is showing a clear split between robust AI-driven demand and soft consumer demand.

Cleaning Is Critical

04/28/2026 | Nolan Johnson, SMT007 Magazine
Mike Bixenman, president of Magnalytix, and his colleagues Vladimir Sitko, founder of PBT Works, and Adam Klett, PhD, director of science at KYZEN, discussed how cleaning can affect reliability, in a Professional Development Course at APEX EXPO 2026. We spoke to Mike after the session to better understand the context for the current activity in cleaning technology.

Infineon Technology Demonstrates Proven Reliability in Space on Artemis II Mission

04/21/2026 | Infineon
NASA's Artemis II mission has successfully returned to Earth after ten days in space, having approached the Moon and reached the farthest distance from our planet ever achieved by crewed spaceflight.
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