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An Examination of Glass-fiber and Epoxy Interface Degradation in Printed Circuit Boards
July 12, 2019 | Bhanu Sood, Michael Osterman, and Michael Pecht, Center for Advanced Life Cycle EngineeringEstimated reading time: 9 minutes
1. Lathi, J.N., Delaney, R.H., and Hines, J.N. “The Characteristic Wear-out Process in Epoxy Glass Printed Circuits for High Density Electronic Packaging,” Reliability Physics 17th Annual Proceeding, pp. 39–43, 1979.
2. Sood, B., and Pecht, M. “Conductive filament formation in printed circuit boards: effects of reflow conditions and flame retardants,” Journal of Materials Science: Materials in Electronics, 22:1602–1615, 2011.
3. Rogers, K., Hillman, C., Pecht, M., and Nachbor, S. “Conductive Filament Formation Failure in a Printed Circuit Board,” Circuit World, Vol. 25 (3), pp. 6–8, 1999.
4. Lando, D.J., Mitchell, J.P., and Welsher, T.L. “Conductive Anodic Filaments in Reinforced Polymeric Dielectrics: Formation and Prevention,” Reliability Physics 17th Annual Proceeding, pp. 51–63, 1979.
5. Domeier, L., Davignon, J., and Newton, T. “A Survey of Moisture Absorption and Defects in PWB Materials,” Proceedings of the 1993 Fall IPC Meeting, pp. 3–5, 1993.
6. William, V. “Conductive Anodic Filament Resistant Resins,” Proceedings of the IPC Printed Circuits Expo, 2002.
7. Mack, H. “Choosing the Right Silane Adhesion Promoters for SMP Sealants,” Adhesive and Sealant Council Meeting in Orlando, Florida, 2001.
8. Rogers K. “An analytical and experimental investigation of filament formation in glass/epoxy composites,” ProQuest Dissertations and Theses, 2005.
9. Materne, T., de Buyl, F., and Witucki, G.L. “Organosilane Technology in Coating Applications: Review and Perspectives,” Dow Corning S.A. and Dow Corning Corporation, 2006.
10. Plueddemann, E. P. In Proc. ICCI-II. “Interfaces in polymer, ceramic, and metal matrix composites,” Hatsuo Ishida, Ed., pp. 17–33, 1988.
11. Hodzic, A., Kim, J. K., and Stachurski, Z. H. Polymer 42:5701-5710, 2001.
12. Gurumurthy, C. K., Kramer, E.J., and Hui, C.Y. “Hydro-Thermal Fatigue of Polymer Interfaces,” Acta Materialia, Vol. 49, pp. 3309–3320, 2001.
13. Ritter, J. E., and Huseinovic, A. “Adhesion and Reliability of Epoxy/Glass Interfaces,” Journal of Electronic Packaging, Vol. 123, pp. 401–403, 2001.
14. Leung, S.Y.Y., Lam, D.C.C., and Wong, C.P. “Experimental Investigation of Time Dependent Degradation of Coupling Agent Bonded Interfaces,” IEEE Electronic Components and Technology Conference, 2001.
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Rachael Temple - AlltematedSuggested Items
Nolan’s Notes: Tariffs, Technologies, and Optimization
10/01/2025 | Nolan Johnson -- Column: Nolan's NotesLast month, SMT007 Magazine spotlighted India, and boy, did we pick a good time to do so. Tariff and trade news involving India was breaking like a storm surge. The U.S. tariffs shifted India from one of the most favorable trade agreements to the least favorable. Electronics continue to be exempt for the time being, but lest you think that we’re free and clear because we manufacture electronics, steel and aluminum are specifically called out at the 50% tariff levels.
MacDermid Alpha & Graphic PLC Lead UK’s First Horizontal Electroless Copper Installation
09/30/2025 | MacDermid Alpha & Graphic PLCMacDermid Alpha Electronics Solutions, a leading supplier of integrated materials and chemistries to the electronics industry, is proud to support Graphic PLC, a Somacis company, with the installation of the first horizontal electroless copper metallization process in the UK.
Electrodeposited Copper Foils Market to Grow by $11.7 Billion Over 2025-2032
09/18/2025 | Globe NewswireThe global electrodeposited copper foils market is poised for dynamic growth, driven by the rising adoption in advanced electronics and renewable energy storage solutions.
MacDermid Alpha Showcases Advanced Interconnect Solutions at PCIM Asia 2025
09/18/2025 | MacDermid Alpha Electronics SolutionsMacDermid Alpha Electronic Solutions, a global leader in materials for power electronics and semiconductor assembly, will showcase its latest interconnect innovations in electronic interconnect materials at PCIM Asia 2025, held from September 24 to 26 at the Shanghai New International Expo Centre, Booth N5-E30
Trouble in Your Tank: Implementing Direct Metallization in Advanced Substrate Packaging
09/15/2025 | Michael Carano -- Column: Trouble in Your TankDirect metallization systems based on conductive graphite are gaining popularity throughout the world. The environmental and productivity gains achievable with this process are outstanding. Direct metallization reduces the costs of compliance, waste treatment, and legal issues related to chemical exposure. A graphite-based direct plate system has been devised to address these needs.