-
- News
- Books
Featured Books
- design007 Magazine
Latest Issues
Current IssueSignal Integrity
If you don’t have signal integrity problems now, you will eventually. This month, our expert contributors share a variety of SI techniques that can help designers avoid ground bounce, crosstalk, parasitic issues, and much more.
Proper Floor Planning
Floor planning decisions can make or break performance, manufacturability, and timelines. This month’s contributors weigh in with their best practices for proper floor planning and specific strategies to get it right.
Showing Some Constraint
A strong design constraint strategy carefully balances a wide range of electrical and manufacturing trade-offs. This month, we explore the key requirements, common challenges, and best practices behind building an effective constraint strategy.
- Articles
- Columns
- Links
- Media kit
||| MENU - design007 Magazine
Decoupled Graphene Thanks to Potassium Bromide
April 29, 2019 | University of BaselEstimated reading time: 2 minutes

The use of potassium bromide in the production of graphene on a copper surface can lead to better results. When potassium bromide molecules arrange themselves between graphene and copper, it results in electronic decoupling. This alters the electrical properties of the graphene produced, bringing them closer to pure graphene, as reported by physicists from the universities of Basel, Modena and Munich in the journal ACS Nano.
Image Caption: Potassium bromide molecules (pink) arrange themselves between the copper substrate (yellow) and the graphene layer (gray). This brings about electrical decoupling, as demonstrated by scanning probe microscopy studies.
Graphene consists of a layer of carbon atoms just one atom in thickness in a honeycomb pattern and is the subject of intensive worldwide research. Thanks to its high level of flexibility, combined with excellent stability and electrical conductivity, graphene has numerous promising applications—particularly in electronic components.
Molecules for Decoupling
Graphene is often produced via a chemical reaction on metallic surfaces in a process known as chemical vapor deposition. The graphene layer and the underlying metal are then electrically coupled, which diminishes some of the special electrical properties of graphene. For use in electronics, the graphene has to be transferred onto insulating substrates in a multistep process, during which there is a risk of damage and contamination.
In order to obtain defect-free, pure graphene, it is therefore preferable to decouple the graphene electrically from the metallic substrate and to develop a method that allows easier transfer without damage. The group led by Professor Ernst Meyer from the Department of Physics and the Swiss Nanoscience Institute (SNI) of the University of Basel is investigating ways of incorporating molecules between the graphene layer and the substrate after the chemical deposition process, which leads to this type of decoupling.
Altering Electrical Properties
In a study carried out by SNI doctoral student Mathias Schulzendorf, scientists have shown that potassium bromide is ideally suited to this. Potassium bromide is a soluble hydrogen bromide salt. Unlike the chemically similar compound sodium chloride, potassium bromide molecules arrange themselves between the graphene layer and the copper substrate. This was demonstrated by researchers in a variety of scanning probe microscopy studies.
Calculations performed by colleagues at the University of Modena and Reggio Emilia (Italy) explain this phenomenon: It is more energetically advantageous for the system if potassium bromide molecules arrange themselves between the graphene and copper than if they are deposited on the graphene—as happens with sodium chloride.
The researchers have shown that the intermediate layer of potassium bromide alters the electrical properties of graphene—until they correspond to those expected for free graphene. “Our work has demonstrated that the graphene and the underlying metal can be decoupled using potassium bromide, bringing us a key step closer to producing clean and defect-free graphene,” says project supervisor Dr. Thilo Glatzel, who is a member of Meyer’s team.
Testimonial
"Our marketing partnership with I-Connect007 is already delivering. Just a day after our press release went live, we received a direct inquiry about our updated products!"
Rachael Temple - AlltematedSuggested Items
Electrodeposited Copper Foils Market to Grow by $11.7 Billion Over 2025-2032
09/18/2025 | Globe NewswireThe global electrodeposited copper foils market is poised for dynamic growth, driven by the rising adoption in advanced electronics and renewable energy storage solutions.
MacDermid Alpha Showcases Advanced Interconnect Solutions at PCIM Asia 2025
09/18/2025 | MacDermid Alpha Electronics SolutionsMacDermid Alpha Electronic Solutions, a global leader in materials for power electronics and semiconductor assembly, will showcase its latest interconnect innovations in electronic interconnect materials at PCIM Asia 2025, held from September 24 to 26 at the Shanghai New International Expo Centre, Booth N5-E30
Trouble in Your Tank: Implementing Direct Metallization in Advanced Substrate Packaging
09/15/2025 | Michael Carano -- Column: Trouble in Your TankDirect metallization systems based on conductive graphite are gaining popularity throughout the world. The environmental and productivity gains achievable with this process are outstanding. Direct metallization reduces the costs of compliance, waste treatment, and legal issues related to chemical exposure. A graphite-based direct plate system has been devised to address these needs.
Closing the Loop on PCB Etching Waste
09/09/2025 | Shawn Stone, IECAs the PCB industry continues its push toward greener, more cost-efficient operations, Sigma Engineering’s Mecer System offers a comprehensive solution to two of the industry’s most persistent pain points: etchant consumption and rinse water waste. Designed as a modular, fully automated platform, the Mecer System regenerates spent copper etchants—both alkaline and acidic—and simultaneously recycles rinse water, transforming a traditionally linear chemical process into a closed-loop system.
Driving Innovation: Depth Routing Processes—Achieving Unparalleled Precision in Complex PCBs
09/08/2025 | Kurt Palmer -- Column: Driving InnovationIn PCB manufacturing, the demand for increasingly complex and miniaturized designs continually pushes the boundaries of traditional fabrication methods, including depth routing. Success in these applications demands not only on robust machinery but also sophisticated control functions. PCB manufacturers rely on advanced machine features and process methodologies to meet their precise depth routing goals. Here, I’ll explore some crucial functions that empower manufacturers to master complex depth routing challenges.