-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueThe Hole Truth: Via Integrity in an HDI World
From the drilled hole to registration across multiple sequential lamination cycles, to the quality of your copper plating, via reliability in an HDI world is becoming an ever-greater challenge. This month we look at “The Hole Truth,” from creating the “perfect” via to how you can assure via quality and reliability, the first time, every time.
In Pursuit of Perfection: Defect Reduction
For bare PCB board fabrication, defect reduction is a critical aspect of a company's bottom line profitability. In this issue, we examine how imaging, etching, and plating processes can provide information and insight into reducing defects and increasing yields.
Voices of the Industry
We take the pulse of the PCB industry by sharing insights from leading fabricators and suppliers in this month's issue. We've gathered their thoughts on the new U.S. administration, spending, the war in Ukraine, and their most pressing needs. It’s an eye-opening and enlightening look behind the curtain.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - pcb007 Magazine
Selecting X-Ray Inspection Equipment
January 24, 2018 | Russell Poppe, JJS ManufacturingEstimated reading time: 6 minutes
The D, of course, stands for dimensions. There are three kinds of systems:
• 2D, which provides a straight top-down view
• 2.5D, which allows top down and tilted or angled views
• 3D, which is a three-dimensional re-construction of the assembly. This might use such techniques as tomography, laminography or (for the full 3D effect) computed tomography, or CT.
Figure 2: In this example, voids in the solder are highlighted in green.
Of course, the more you get to see, the slower the inspection is. Complex CT scans for example can take hours to make. If the aim is to look at missing solder balls under a BGA for example, or shorts between them, then 2D can be fine. However, tilting can help get a better view if there are components obscuring the area of interest. 3D might be used for detailed quality investigations.
3. Ease of use
Some systems allow a degree of automated inspection, for example by programming sequences of inspections with pass/fail criteria. This of course makes repeatable inspection and operation very easy, and allows an in-line process if required. Setting it up though, or performing ad-hoc inspections, does require some skill.
While modern X-ray systems are easy to use, the inspector does need to understand what all the settings do (e.g., the voltage and contrast settings we mentioned before) and be able to interpret what they are seeing, which does require a reasonable knowledge of PCB assembly. There can be features that make image interpretation a bit easier, for example, by applying color.
4. Maintenance
It is worth remembering that the Health & Safety Executive (HSE) must be notified before using X-ray equipment. Obligations may also exist around creating rules or procedures for use, and engaging radiation protection supervisors and advisors. The equipment supplier should be able to provide advice, and it is a good idea to have them perform an (at least) annual health check on the system. It is also worth mentioning that there are different types of X-ray tube. ‘Open tube’ types are relatively quick and inexpensive to replace—perhaps a few pounds and a couple of hours—but need doing so after every 200-300 hours or so of use. ‘Closed tube’ types can last for many years but are much more expensive, maybe thousands of pounds. So perhaps the best choice depends on how much you will use the system.
The X-ray detectors tend to be standard or high-definition flat panels. The X-rays will cause these to degrade over time, typically around 20% after 10 years. While still usable, replacement after eight to 12 years could be advisable.
It is also worth finding out the common failure modes on systems, as while the component parts are similar, they can be assembled in different ways. For example, power supplies, connectors or cables can need replacing in time. Hopefully, this article has helped you understand some of the areas to focus on when looking to invest in X-ray inspection equipment.
Page 2 of 2Suggested Items
Preventing Surface Prep Defects and Ensuring Reliability
06/10/2025 | Marcy LaRont, PCB007 MagazineIn printed circuit board (PCB) fabrication, surface preparation is a critical process that ensures strong adhesion, reliable plating, and long-term product performance. Without proper surface treatment, manufacturers may encounter defects such as delamination, poor solder mask adhesion, and plating failures. This article examines key surface preparation techniques, common defects resulting from improper processes, and real-world case studies that illustrate best practices.
Breaking Silos with Intelligence: Connectivity of Component-level Data Across the SMT Line
06/09/2025 | Dr. Eyal Weiss, CybordAs the complexity and demands of electronics manufacturing continue to rise, the smart factory is no longer a distant vision; it has become a necessity. While machine connectivity and line-level data integration have gained traction in recent years, one of the most overlooked opportunities lies in the component itself. Specifically, in the data captured just milliseconds before a component is placed onto the PCB, which often goes unexamined and is permanently lost once reflow begins.
BEST Inc. Introduces StikNPeel Rework Stencil for Fast, Simple and Reliable Solder Paste Printing
06/02/2025 | BEST Inc.BEST Inc., a leader in electronic component rework services, training, and products is pleased to introduce StikNPeel™ rework stencils. This innovative product is designed for printing solder paste for placement of gull wing devices such as quad flat packs (QFPs) or bottom terminated components.
See TopLine’s Next Gen Braided Solder Column Technology at SPACE TECH EXPO 2025
05/28/2025 | TopLineAerospace and Defense applications in demanding environments have a solution now in TopLine’s Braided Solder Columns, which can withstand the rigors of deep space cold and cryogenic environments.
INEMI Interim Report: Interconnection Modeling and Simulation Results for Low-Temp Materials in First-Level Interconnect
05/30/2025 | iNEMIOne of the greatest challenges of integrating different types of silicon, memory, and other extended processing units (XPUs) in a single package is in attaching these various types of chips in a reliable way.