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Four IC Industry Clusters Emerge with China's 13th Five-Year Plan
September 26, 2016 | TrendForceEstimated reading time: 2 minutes
The development of China’s semiconductor sector has gained new momentum in the first year of the country’s 13th Five-Year Plan (2016~2020). According to the global market research firm TrendForce, committed policy efforts and investments from the Chinese government have resulted in the formation of four IC industry clusters that are respectively located in the country’s four major regions of activities – the Yangtze River Delta, the Pearl River Delta, the Beijing-Tianjin Bohai Sea region and the Central-Western region.
By the end of the 13th Five-Year Plan in 2020, the domestic IC industry is expected to achieve an annual revenue growth of over 20% and have caught up to the international standards in terms of technology and manufacturing. Because the government since 2000 has been promoting the development of IC supply chains within the country’s Pilot Free Trade Zones, related industry clusters have thus emerged from these areas.
The Yangtze River Delta has Shanghai as its core, and its IC industry cluster generated an annual revenue of around RMB 179.2 billion in 2015 – the highest among the four regions. TrendForce’s analysis shows that IC industry in the Yangtze River Delta mainly involves the mid- and downstream sections of the IC supply chain. China’s most advanced IC manufacturing and packaging/testing technologies are concentrated in this area.
The Pearl River Delta has Shenzhen as its center, and the annual revenue of the region’s IC industry cluster reached RMB 68.8 billion in 2015, with fabless IC design making up the largest share. Huawei’s subsidiary Hisense is the leading IC manufacturer in the area and serves as an important local hub for product design and the integration of systems and applications.
The heart of the IC industry within the Beijing-Tianjin Bohai Sea region is Beijing’s Zhongguancun Science and Technology Zone. This industry cluster focuses on design, manufacturing and application development. The IC revenue from the region totaled 62.5 billion in 2015. Major industry-related enterprises in the area include SMIC (Beijing) and Tsinghua Unigroup.
The revenue from the IC industry cluster in the Central-Western region reached RMB 50.5 billion in 2015. The region is currently being developed to become the main manufacturing base of China’s NAND Flash industry. Major fabs in the region include Samsung’s 3D-NAND fab in the city of Xian and XMC’s fab in the city of Wuhan. The latter facility is being expanded to take on additional NAND Flash production. XMC furthermore formed a holding company called Yangtze River Storage Technology with Tsinghua Unigroup this July. The new holding company will gather and allocate resources for the development of the domestic NAND Flash industry.
In addition to these four regions, the IC industry in Fujian Province has also attracted growing interests. The province is the home of Fujian Jin Hua Integrated Circuit (JHICC), a semiconductor enterprise that will play a major role in fulfilling the IC production targets of the 13th Five-Year Plan. JHICC’s most crucial investment related to the Five-Year Plan is its DRAM fab located in the prefecture-level city of Quanzhou.
Furthermore the provincial government and United Semiconductor Xiamen (or USCXM, the China-based subsidiary of the major foundry UMC) have formulated an ambitious plan to create an IC industry ecosystem linking several major cities along its eastern coastline, including Fuzhou, Xiamen, Quanzhou and Putian. TrendForce believes that the southeastern region of the country will have a bigger influence in the overall domestic IC industry if Fujian’s cluster can collaborate with its counterpart in the Pearl River Delta.
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Brent Fischthal - Koh YoungSuggested Items
Hall of Fame Spotlight Series: Highlighting Karen McConnell
05/07/2026 | Dan Feinberg, I-Connect007In 2021, Karen McConnell was awarded the Raymond E. Pritchard Hall of Fame award in recognition of her contributions to the Association and the electronics industry. As a senior staff member and CAD/CAM engineer at Northrop Grumman Enterprise Services, her primary responsibility was to develop a common, shared EDM (Electronic Document Management) library to support the electrical and PCB design tool initiatives across Northrop Grumman Mission Systems.
A Necessary Shift From Gerber to IPC-2581
05/07/2026 | Tracy Riggan, Global Electronics AssociationIPC-2581 is an open, vendor-neutral data exchange standard developed by the Global Electronics Association to streamline the exchange of PCB design information across fabrication, assembly, and test. It replaces multiple legacy formats—including industry standards, Gerber, and ODB++—with a single, comprehensive, XML-based dataset that captures all manufacturing details.
Meet Emerging Engineers: Patrick Owen and Eric Mickenbecker, Summit Interconnect
05/05/2026 | Michelle Te, I-Connect007Patrick Owen and Eric Mickenbecker both work for Summit Interconnect, and are in their second year of the Global Electronics Association’s Emerging Engineer Program with mentor Brian Chislea. They stopped by the I-Connect007 booth at APEX EXPO and shared a bit of their story with me. Patrick has worked at the Hollister, California, plant since 2018, while Eric has been at the Chicago site since 2023. Like many of their peers, they came to the electronics industry from different paths, but are both excited about making an impact.
PCBAA, AAM Take on the Fight to Rebuild U.S. Manufacturing in New Documentary
05/05/2026 | Marcy LaRont, I-Connect007Throughout most of the 20th century, manufacturing was central to the American Dream of providing stable jobs and pathways to upward mobility. Today, more than 80% of global electronics manufacturing capacity resides in China and greater Asia, raising serious concerns about supply chain resilience and national security.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
05/01/2026 | Michelle Te, I-Connect007If it feels like the PCB industry is accelerating faster than ever, you’re not imagining it. From advanced materials driven by AI applications to renewed investment in domestic manufacturing—and the next generation stepping into critical roles—there’s a lot shifting at once. My selections for this week highlight where the pressure points are forming, and where the opportunities are emerging.