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Fujifilm to Showcase Semiconductor Materials and India Commitment at SEMICON India 2026

09/17/2026 | Fujifilm
Demonstrate its leadership in the semiconductor material ecosystem development space at Hall 1, Booth 623 from September 17–19 at Yashobhoomi,

LPMS USA to Highlight Local Supply and Simplified Electronics Protection at SMTA Guadalajara

09/17/2026 | LPMS USA
LPMS USA, a leading provider of integrated low pressure molding solutions for electronics protection, will exhibit at the SMTA Guadalajara Expo & Tech Forum, October 7–8, 2026, at Expo Guadalajara.

Rehm Thermal Systems at Bondexpo 2026: Precise Dispensing Meets Efficient UV LED Curing

09/15/2026 | Rehm Thermal Systems
When the industry meets at Bondexpo in Stuttgart from 6 to 8 October 2026, Rehm Thermal Systems will also be presenting innovative equipment solutions for precise dispensing, potting and curing processes. In hall 6 at  booth 6505, the company will showcase the ProtectoXC and the RDS UV LED – two powerful systems designed for flexible, efficient and reproducible production processes.

Global Sourcing Spotlight: Finding Your Greatest Sourcing Asset in Partnerships

09/16/2026 | Bob Duke -- Column: Global Sourcing Spotlight
Something I’ve learned over time is that when supply is tight or a disruption hits, procurement teams can quickly determine which supplier relationships are working. A supplier that understands your business is more likely to call early about a material shortage, suggest an alternative, or find room in a crowded production schedule. That response has become increasingly valuable as tariffs shift, trade routes change, and materials fluctuate in cost and availability.

Advanced Packaging at the Limits: What’s Ahead in the Next Issue of Advanced Electronics Packaging Digest

09/15/2026 | I-Connect007
The upcoming issue of Advanced Electronics Packaging Digest looks at what happens as advanced packaging pushes further into the limits of scale, power, thermal performance, and manufacturing capability. These features examine the measurement technologies, materials decisions, manufacturing investments, and system-level challenges shaping the next generation of advanced electronics.
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