Latest Articles

AI Reshaping the Memory Market; Effects Spreading Across Industries

Artificial Intelligence is often framed as a software story focused on algorithms and models. But beneath that narrative lies a more fundamental shift rooted in hardware. AI is not just changing what technology can do; it’s changing how the physical components behind it are produced, allocated, and priced. One of the clearest examples of this shift is now emerging in the global memory market.

EDADOC: Building the ‘Neural Hub’ for High-Compute Chips Within a Compact Space

Every chip to the market must pass a stringent checkpoint before shipment known as ATE testing. Serving as the physical “neural hub” that connects test equipment worth millions of dollars with the device under test, the performance of the ATE test board directly determines the accuracy, efficiency, and final yield of chip testing. Amid the rapid rise of high-compute chips, what extreme challenges is this seemingly small circuit board facing? How is EDADOC addressing industry pain points through its one-stop “design + manufacturing” model?

Cleaning Is Critical

Mike Bixenman, president of Magnalytix, and his colleagues Vladimir Sitko, founder of PBT Works, and Adam Klett, PhD, director of science at KYZEN, discussed how cleaning can affect reliability in a Professional Development Course at APEX EXPO 2026. We spoke to Mike after the session to better understand the context for the current activity in cleaning technology.

Roundtable: Data Protection Lays the Groundwork for Cybersecurity Strategies

This multi-expert roundtable explores cybersecurity measures specific to electronics manufacturing. NEC’s Watanabe Hiroyaki, Divyash Patel, CEO of MX2 Technologies, and Ali Pabrai, CEO at EC First, join moderator Nolan Johnson for a deeper discussion on cybersecurity certifications.

Design for Test: A New Book from The Test Connection, Inc.

Bert Horner, president of The Test Connection Inc., shares insights on designing for testability (DFT) challenges with Kelly Dack. Horner discusses the critical need for incorporating testability early in the design process and the importance of quantifiable metrics for measuring test coverage. He highlights The Test Connection's role in transferring decades of 'tribal knowledge' to emerging engineers through training and education. Look for "The Printed Circuit Assembler's Guide to... Design for Test, A Practical Guide to Test and Inspection" in the I-007eBooks library.

A Mic, a Tiny Cam, and the Show Floor: The Story Behind 'Take the Mic!'

I-Connect007’s Take the Mic! program at APEX EXPO 2026 in Anaheim is proving to be a must-watch feature for this year’s event coverage, as we invited company representatives to participate in a sponsored conversation about their businesses and products in a whole new way: in front of a camera at their booths. While our managing editors and guest editors were conducting slightly longer Real Time with… APEX EXPO interviews in our booth, three staff members and guests acted as roaming reporters, conducting short, prearranged interviews with several companies exhibiting on the show floor.

An Interview With Keynote Speaker Zack Kass on the 'AI Renaissance'

Zack Kass is an AI evangelist, technologist, businessman, and the author of The Next Renaissance: AI and the Expansion of Human Potential. He was a key player in bringing open AI to market and the keynote speaker at APEX EXPO 2026. Immediately following his presentation, I brought Zack to our booth, where we had a most eye-opening conversation about both the positive and negative impacts of artificial intelligence, and going beyond what’s “impossible.”

PHOTO GALLERY: A Walk on the Lighter Side

APEX EXPO isn’t all business! To wrap up our last photo gallery, we’re sharing some of our favorites from the show—a walk on the lighter side. We’re highlighting those in-between moments: quick selfies, familiar faces reconnecting, robot dogs, booth-side laughs, and the kind of candid snapshots you only get when people are genuinely enjoying themselves. At the end of the day, it’s not just about what we do, it’s about the people we do it with.

Institute of Circuit Technology Spring Seminar 2026: A Bright Future in Europe

Through the leafy lanes and spring flowers of Warwickshire and back to Meridan, the traditional centre of England, and now officially part of the Metropolitan Borough of Solihull in the county of the West Midlands, I attended the Annual General Meeting and Spring Seminar of the Institute of Circuit Technology (ICT) on April 14. Out of the AGM came notable changes in leadership at the top of the Institute: the retirement of Mat Beadel as chair and Emma Hudson as technical director. Effective May 1, Steve Driver is the new chair, and Alun Morgan is the new technical director.

India’s Vasantha Advanced Systems: EMS Success for 30 Years

Based in one of India’s premier manufacturing regions, Vasantha Advanced Systems is an EMS provider that has built a reputation for quality, reliability, and long-term customer partnerships, earning repeated recognition from the Indian government through its National MSME Awards. Now, with a full spectrum of capabilities spanning PCB assembly, box build, and wire harness, and a workforce of more than 500, Vasantha is expanding its presence into the U.S. market. At APEX EXPO, I met Dr. Chidambaranathan and learned how this rising global player is positioning itself to meet the evolving needs of North American customers.

New Guidance Targets Scope 3.1 Emissions Gap in Electronics Supply Chains

A new industry guidance document aimed at improving how electronics companies account for Scope 3 Category 1 (Scope 3.1) emissions marks a significant step toward more consistent and effective supply chain decarbonization. A recent webinar hosted by the Global Electronics Association and the Responsible Business Alliance (RBA) addressed a persistent challenge: Despite the material impact of Scope 3.1 emissions, fewer than half of electronics companies currently report them.

Mexico’s Wire Harness Pivot Point

Mexico is a major producer of wire harnesses, but recent U.S. economic policies and Mexico’s domestic issues have had a ripple effect on the industry. Jesus Duarte, vice president of Mexico Assembly Wire Technology and president of Expo Wire Tech, explains the issue in greater depth and how the wire harness industry should respond on its own, rather than just reflect what Tier 1s are doing.

Advanced Electronics Packaging at APEX EXPO with Matt Kelly

The first advanced electronics packaging conference at APEX EXPO 2026 was well-received this year with an engaged audience. Matt Kelly, CTO of the Global Electronics Association, says the expanded focus on component and system-level integration fosters unprecedented collaboration across the industry. Also new this year were the Design Pavilion and Technology Theater, which brought commercial value to technical discussions and highlighted the critical role of timely standards development in rapidly evolving sectors such as AI and automotive.

Siborg LCR-Reader Professional Multimeter

Michael Obrecht showcases the LCR-Reader professional benchtop multimeter from Siborg Systems Inc. Obrecht discusses the compact, Canadian-made device that offers the functionality of expensive benchtop meters at an accessible price. He details versatile measurement capabilities, including LCR, ESR, resistance, capacitance, and advanced features like signal generation and oscilloscope mode.

Indium Faces Complex Soldering Head On

Kevin Brennan of Indium Corporation discusses the complexities of soldering diverse component sizes on high-performance computing boards. He introduces DuraFuse LT solder paste, a novel solution designed to address challenges like uneven heating and warpage during reflow. This innovative alloy enables a wider operational window, reducing peak temperatures and enhancing product reliability without requiring board redesign.

The Future of Reflow Soldering Is Here

Michael Hanke discusses how Rehm Thermal Systems is revolutionizing thermal solutions in electronics assembly with their innovative flux-free, no-clean soldering process. This is truly a game changing process that eliminates chamber cleaning and streamlines production. Developed with paste suppliers, this advanced technology promises significant time and cost savings while ensuring high-quality results.

At KYZEN, Cleaning is All About Reliability

Jason Schwartz discusses KYZEN's advanced cleaning solutions for PCB assembly with Dan Beaulieu at APEX EXPO 2026. KYZEN has a 35-year legacy in defluxing, innovative real-time process control, and commitment to ensuring electronic reliability. How KYZEN partners with manufacturers through process audits and lab testing to maintain optimal cleaning standards is part of this conversation.

From AI to AEP, an Impressive Array of Keynotes at APEX EXPO 2026

Each year at APEX EXPO, the Global Electronics Association provides an impressive lineup of keynote speakers to kick off the largest electronics manufacturing event in North America. This year included four keynote speeches, on topics ranging from the promise and peril of AI to the power of electronics, quantum computing, and the importance of heterogeneous integration in advanced electronics packaging.

PHOTO GALLERY: Putting in the Work on Standards, Professional Development

Behind every standard, innovation, and step forward in electronics are the people who show up to do the work. This week's photo gallery highlights the attendees who filled meeting rooms and classrooms throughout APEX, collaborating on standards development committees, sharing expertise, and investing in their own growth through professional development. These are the faces of progress, gathered not just to learn, but to contribute and shape what comes next.

AI, Connectivity, and Systems-Level Thinking: New Frontiers in Advanced Packaging

The upcoming issue of Advanced Electronics Packaging Digest examines key developments shaping the next phase of electronics innovation, from the reliability challenges of AI-driven packaging to emerging connectivity standards and the broader systems-level implications of artificial intelligence.

Breaking the Manual Quoting Bottleneck in Wire Harness

Arik Vrobel has spent more than 35 years in wire harness manufacturing—starting in EL-Com, his father's shop, building it into a nationally recognized contract manufacturer, and ultimately selling to Aptiv/Winchester in 2021. But retirement didn't last long. Within months, Arik was back, not as a manufacturer this time, but as a technologist. His new company, Cableteque, is building the quoting and data automation platform he always wished existed.

SMTA Ultra HDI Symposium, Day 2: Fragile Supply Chains, Fierce Innovation

The Arizona weather yielded another beautiful day as we gathered for the second day of SMTA’s annual UHDI symposium. After the first full day discussing the role of AI in business and the how-tos of implementation, Avondale Mayor Mike Pineda kicked off day two, proud to showcase his city and to declare its important place in the continued development of the West Valley, an increasingly important area for tech and manufacturing.

Regional Electronics Growth and Initiatives with Gaurab Majumdar

Nolan Johnson interviews Gaurab Majumdar, vice president of Global Electronics Association India and South East Asia, about positive developments in the regions he oversees. Key initiatives include an MoU with India's Ministry of Defense for a PCB test lab in Bangalore and workforce development programs in Southeast Asia. These efforts aim to bolster local industries, reduce costs, and foster self-sufficiency in semiconductors and PCBs.

SMTA Ultra HDI Symposium, Day 1: AI at the Core or Out of the Game

It was a beautiful 81°F morning in Arizona last Wednesday as I headed to the third annual SMTA Ultra HDI Symposium, focused on AI and ultra high density interconnect technology. Strategically held as part of Arizona’s Tech Week, this year’s conference took place in Avondale in Phoenix's West Valley. The event moved from the cozy offices of the Peoria Sports Complex (which paid homage to baseball’s spring training world) to the larger Avondale Conference Center, highlighting the importance of this area for electronics manufacturing investment.

The Next Generation of Leadership: New Student Board Member Aubrey Smith 

At APEX EXPO 2026, the next generation of industry leadership was on full display with the introduction of Aubrey Smith, the Global Electronics Association’s newest Student Board Member. She’s a third-year electrical and electronics engineering student at the University of Georgia and a first-year participant in the Emerging Engineer Program. Aubrey represents the curiosity, initiative, and openness that define tomorrow’s innovators.

Solder Paste Innovations for Enhanced Reliability from MacDermid Alpha Electronics Solutions

Jason Fullerton of MacDermid Alpha Electronics Solutions discusses innovative alloys like Innolot MXE, low-temperature solder options, and polymer reinforcement strategies. Learn how these solutions address the growing demands of high-performance computing and larger component assemblies, ensuring optimal performance and cost-effectiveness.

Accelerating Electronic Supply Chains With Luminovo

Timon Ruban, founder of Luminovo, explains how his company's electronic supply chain platform is revolutionizing the quoting process for contract manufacturers, reducing BOM pricing time from days to under an hour. Learn about their AI strategy and vision for coordinating company knowledge work through supply chain data in this interview.

Frank Sommer Discusses Selective Soldering Innovations for EVs

Dan Beaulieu sits down with Frank Sommer, a selective soldering expert from Nordson Electronics Solutions, to discuss the resurgence of selective soldering driven by electric vehicle manufacturing, and the need for robust through-hole component integration. He also introduces Nordson's innovative SELECT Synchro selective soldering machine, designed for enhanced throughput and flexibility.

Future-proof Laser Depaneling for PCBs with Photonics

Bill Solari of Photonics Systems USA outlines the advantages of laser depaneling for circuit board manufacturing. We learn that this advanced technology addresses rising material costs by increasing panel yield and improving edge quality. This process provides precision, suitability for medical applications, and cost-saving benefits, including the elimination of cleaning steps. There have been significant advancements in laser depaneling, offering a competitive and efficient solution for modern electronics production.

Smarter AOI: Delvitech Brings Native AI to APEX EXPO

Marcy LaRont speaks with Delvitech founder and CEO Roberto Gatti about the company’s AI-native inspection technology and its growing global presence. Gatti explains how Delvitech’s integrated hardware and neural-network–driven platform is unique in the market with unmatched flexibility for implementation across multiple lines and multiple facilities.

Technica USA and DCT Partnership Insights

This discussion features Jason Perry from Technica and David Bures from DCT Cleaning, highlighting Technica's expansion in PCB fabrication and assembly. DCT, a leader in cleaning solutions, emphasizes the renewed importance of cleaning in modern electronics due to miniaturization. Comprehensive offerings and an innovative approach to achieving optimal cleanliness is revealed.

Meet Emerging Engineer Logan Bistodeau, IBM

When he was growing up, Logan Bistodeau was always interested in how heavy machinery worked, so it was natural that he earned a mechanical engineering degree at Iowa State University. He originally grew up near the Twin Cities in Minnesota, now works for IBM, and is in his first year of the Emerging Engineer Program through the Global Electronics Association. I got to know Logan a little better at APEX EXPO 2026.

Wire Harness Taking a Step in the Right Direction

To fully understand the modernization of wire harness design and assembly, we met with members of the Innovation Advisory Team for the Wire Harness Manufacturer’s Association (WHMA) to outline the current challenges facing wire harnesses and the specific steps to implement a digital data flow from OEM to manufacturer and back. In some ways, the wire harness industry is moving from 19th-century to 21st-century technology. But in the meantime, the real challenge isn’t building the harness—manufacturers are very good at that.

From Panels to Post-its

Last January, I attended the Global Leadership Summit of the Wire Harness Manufacturer’s Association (WHMA) in Las Vegas, and there was a subtle shift in one of the events that everyone could feel. We still had the traditional conference rhythm: strong keynote, well-prepared panels, and smart people in the room. There were also, sometimes, some careful answers—useful, but not always candid. So, I was curious when WHMA introduced a new peer-to-peer format for one session.

East Asia's Electronics Dominance and AI with Sydney Xiao

Sydney Xiao, Global Electronics Association – East Asia President emphasizes the region's dominance in electronics manufacturing, particularly with the rise of AI. The association focuses on standards, workforce, technology, and collaboration to help members navigate AI opportunities, highlighting new IC substrate standards and advanced packaging initiatives.

2026 IPC Masters Competition China Wraps Up With Record Participation

The three-day 2026 IPC Masters Competition concluded March 27 at productronica China in Shanghai, bringing together the largest and most highly skilled group of electronics assembly professionals in the event’s 16-year history. With 623 participants from 77 companies across China—up 30% from last year—the competition reflected a growing focus on the practical application of electronics manufacturing standards.

Take the Mic: Squeegees: Where the Rubber Meets the Road

Explore the crucial role of squeegees in modern electronics manufacturing with insights from Mark Curtin of Transition Automation. This interview from APEX EXPO 2026 delves into advancements in squeegee technology, focusing on material innovation and automated systems for enhanced reliability. Learn how refined squeegee edges are vital for printing fine components and ensuring the integrity of solder joints in high-demand applications.

Take the Mic: Smart and Flexible SMT Solutions from Essemtec

Essemtec is known for naturally adaptive machines inspired by nature and designed for advanced HDI as well as package substrate manufacturing. Pierre-Jean Cancalon discusses new 2K dispensing and high-speed solder paste jetting technologies, perfect for NPI prototyping and flexible production environments.

Mycronic's AI Innovations for Manufacturing

Mycronic has made groundbreaking advancements in AI-driven manufacturing solutions. Kevin Clue, VP of Global Sales, details their investment in AI to simplify machine operation, programming, and data analysis. GenI Generative AOI Programming, a revolutionary feature enabling zero programming for AOI systems, empowers de-skilled operators and addresses workforce challenges. Mycronic's interconnected solutions enhance efficiency and customer value.

The Pivotal Role of AI in Modern Electronics Manufacturing with Koh Young

Joel Scutchfield, of Koh Young America shares how accurate, measurement-based data fuels AI engines for enhanced inspection, auto-programming, and defect classification. Joel emphasizes how self-correction capabilities and data sharing across production lines, driving towards a future of automated, defect-free manufacturing.

Foundational Knowledge at Blackfox Training Institute

Marcy LaRont interviews Austin Addison from Blackfox Training at APEX EXPO 2026. Blackfox offers comprehensive IPC standards training, including J-Standard and specialized courses. Programs are tailored to individual needs, offering flexible training options and emphasizing the foundational knowledge required for certification.

PHOTO GALLERY: A Show Floor Showcase, Part 2

Take a walk back through APEX EXPO with our photo gallery, capturing the faces, moments, and energy from across more than 400 booths on the show floor. This week, we’re highlighting our many customers, and some of the work in the I-Connect007 booth, where we conducted dozens of video and audio interviews. It’s a chance to see who was there, what was happening in real time, and maybe even spot yourself in the crowd.

Women in Electronics Keynote Review: A Life and Career Filled With Humor

In an industry that was dominated by male comedians, Jan McInnis quickly learned an important tip to help her succeed in the business: Don’t ask for permission to be yourself. “Don’t try to be something you’re not,” she said after headlining the Women in Electronics event at APEX EXPO 2026. “They’re paying for you and what you bring to the table, so put your blinders on, and just do your thing.”

An Update on the Omnibus on Sustainability Reporting

The European Commission (EC) released its Omnibus on Sustainability Reporting Proposal on Feb. 26,  2025, as part of its agenda to simplify EU sustainability legislation and reduce administrative burdens for companies while safeguarding the objectives of the EU Green Deal, including content and a timeline proposal. The initial “content” proposal amended key content-related provisions of the Corporate Sustainability Reporting Directive (CSRD), the Corporate Sustainability Due Diligence Directive (CSDDD), and the EU Taxonomy (EUT) Regulation.

North American Electronics: Growth & Challenges with Joe Schneinder

Nolan Johnson interviews Joe Schneider of the Global Electronics Association about North American electronics industry trends. Schneider discusses the surge in US data center demand, the association's work on AI standards, and strategic focus on aerospace and defense. The conversation addresses workforce development and capacity challenges, highlighting Global Electronics Assiciation's commitment to supporting member growth and knowledge acquisition in 2026.

SMTA Dallas Expo & Tech Forum: A National-level Local Event

Gary Tanel is the long-time chapter president of SMTA Dallas. He has been active in the industry for many years, retiring from Texas Instruments and Raytheon and then starting his own contract manufacturing company. He has been on the board of directors of SMTA and has held every office at the national and local level. He has received both the Founder’s and the Excellence in Leadership Awards from SMTA. Gary has been the SMTA Dallas Expo chair for many years, including for the 23rd annual show.

What APEX EXPO Award Recipients See for the Future of Electronics Manufacturing

The single most transformative shift in the electronics manufacturing industry over the next decade will be the convergence of AI-driven design with advanced packaging architectures, according to some of the APEX EXPO 2026 award recipients, but success will rely on how well the industry bridges the talent gap. Recent award recipients express optimism over technological breakthroughs, from chiplet platforms and copper-to-copper hybrid bonding, to fighting the increasing incidence of conductive anodic filamentation (CAF) in flight hardware. Others see a workforce that can’t accelerate as quickly as the technology.

Educational Highlights From the APEX EXPO 2026 Show Floor

APEX EXPO 2026 featured many legacy treasures, but it was the inaugural year for the Technology Pavilion, which featured 10 speakers over two days. It was just one feature on the show floor that specifically highlighted technical learning and innovation. Topics presented at the Technology Pavilion included copper nanoparticle inkjet printing on rigid PCBs, how AI and collaboration can level up an electronics supply chain, accelerating the design-to-manufacturing flow, and automated spatial micro-sectioning.

Viscom AI Inspection Technology Explained

Jesper Lykke discusses how AI revolutionizes automated inspection and programming, significantly enhancing speed and accuracy. Viscom's V-Vision and ProVision software, featuring advanced AI integration.solutions for industry challenges like miniaturization and large circuit board inspection, serve the booming demand for data center and backplane boards.

Take the Mic: Advanced Encapsulation Process with LPMS USA

Explore LPMS USA's innovative low pressure molding process for LED circuits, demonstrated by Brian Betti at APEX EXPO 2026. Witness the KAPPA 1100H machine utilizing a low-viscosity polyamide resin to safely encapsulate sensitive components. This professional demonstration highlights advanced manufacturing techniques and the versatility of low-pressure molding for electronic applications.

Take the Mic: Customer-Driven Innovation in Materials with Koki

Koki's innovative approach to customer-centric product development is highlighted in this show floor interview with Shantanu Joshi at APEX EXPO 2026. Learn how Koki collaborates with clients to create tailored silver and coating solutions, addressing challenges like voiding and enhancing reliability. The company's micro-alloying techniques and free analytical services designed to optimize performance and manage costs.

Akrometrix Discusses AI Chip Board Demands

Paul Handler of Akrometrix discusses the evolving demands in PCB fabrication, particularly the surge in large-format, room-temperature boards for AI chips. He highlights the critical need for inline, real-time testing of heavy, high-value circuit boards and Akrometrix's strategic shift towards integrated Industry 4.0 solutions. Handler also highlights the engineering challenges and the company's positive outlook for industry growth.

Remtec: Advanced Ceramic PCB Solutions

Explore Remtec's advanced PCTF® technology and its critical role in power electronics and heat dissipation. Dan Beaulieu and Brian Buyea chat about Remtec's US-based manufacturing capabilities, innovative assembly processes, and the superior thermal conductivity of their ceramic substrates. Remtec is shaping the future of high-performance components for defense, aerospace, and automotive industries.

Mexico's Electronics Growth and Future With Lorena Villanueva

Lorena Villanueva, director of the Global Electronics Association Mexico, discusses the burgeoning role of the electronics industry in Mexico, highlighting significant membership growth and the "three helix" approach to sector development. The conversation with Marcy Laront also touches upon workforce training, global curriculum adoption, and initiatives to encourage female participation in electronics.

Balanced Approach Needed to Regulate PFAS in Electronics

The very broad per- and polyfluoroalkyl substances (PFAS) group has widespread use in both consumer and highly specialized applications, including, perhaps surprisingly, green technologies. Among these, the fluoropolymers subgroup plays a complex and critical role in electronics. To date, there are hardly any technically comparable alternatives. The electronics industry is facing a major regulatory and business challenge as inconsistent policies on potential PFAS restrictions in electronics are emerging across regions worldwide, and, in the U.S., in different states.

The Electronics Foundation: Empowering Students, Strengthening Industry

The Electronics Foundation may be one of the industry’s best-kept secrets, but its impact is anything but small. In this interview, Charlene Gunter and Gentry Manning discuss how the Foundation is building a pipeline of future electronics professionals through student chapters, scholarships, hands-on STEM programs, and global outreach. From high schools to universities, and from soldering kits to career exploration, they share how meaningful industry engagement is opening doors for students while helping manufacturers address workforce needs.

SMT Renting: Redefining Equipment Investment

SMT Renting, based in Copenhagen, is challenging the traditional machine-ownership model with a flexible, service-based approach. Business Manager Christian Thers discusses how rental options, “stop and swap” flexibility, and a new pay-per-placement model help electronics manufacturers reduce risk and adapt quickly in an unpredictable market.

Rethinking Test Strategy: New Book Tackles DFT for Today’s Complex Electronics

I-Connect007 proudly announces the release of The Printed Circuit Assembler’s Guide to… Design for Test: A Practical Guide to Test and Inspection. As electronics grow more complex, geometries shrink, and packaging densities increase, traditional testing and inspection methods are no longer sufficient. In this timely new release, industry expert Bert Horner of The Test Connection, Inc. provides a practical roadmap for integrating design for test (DFT) into PCB and CCA development, beginning at schematic capture and layout, rather than treating testing as an afterthought.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

It’s been a busy week for many of us traversing the conference halls and exhibition floor at APEX EXPO in Anaheim, California. This is the 26th event since it was renamed APEX EXPO in 2000. For those who love trivia, and in reverence to the founders, a more accurate accounting is that 2026 marks its 33rd year, beginning in 1994 as the IPC Printed Circuits Expo. It’s always a great time to convene with old friends, colleagues, and customers, as well as to meet exciting new companies and individuals with interesting things to share. And afterwards, it’s always nice to get home.

EMS Leaders Express Optimism Through Growth and Expansion

It was a strong opening day for APEX EXPO 2026, with a keynote by Zach Kass on the AI revolution, followed by a ribbon-cutting to officially open the event, which featured Irish dancers on this St. Patrick’s Day, and opening remarks by Global Electronics Association CEO John Mitchell. But I’d like to tell you about the EMS Leadership Summit on Monday, where approximately 60 EMS industry leaders from 40 companies participated. There were several speakers, a panel discussion, and discussion groups.
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