Standard of Excellence: Speed vs. Quality in Customer Service
TTCI Brings Hands-On Test Engineering and IPC Training Expertise to PCB Carolina 2025
The Test Connection Inc. (TTCI), a trusted provider of electronic test and manufacturing solutions, and The Training Connection LLC (TTC-LLC) will...
NEDME 2025 Draws Strong Northwest Crowd, Builds on Tradition of Regional Collaboration
The NW Electronics Design & Manufacturing Expo (NEDME) 2025 once again brought together the Pacific Northwest community for a full day of learning,...
KYZEN Honored with 2025 Step-by-Step Excellence Award for Its Innovative ANALYST² Process Control System
KYZEN, the global leader in innovative environmentally responsible cleaning chemistries, is proud to announce that its ANALYST² Process Control...
The Training Connection Continues to Grow with Addition of Veteran IPC Trainer Bill Graver
The Training Connection, LLC (TTC-LLC), a premier provider of test engineering and development training, is proud to announce the addition of Bill...
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I-Connect007 Editor’s Choice: Five Must-Reads for the Week
October 31, 2025 | Nolan Johnson, I-Connect007
Last week, the IMPACT conference took place in Taipei, bringing together advanced packaging experts from around the globe to share their knowledge. We’ll be bringing you post-conference coverage over the next few weeks, so look for that in our newsletters, and in the Advanced Electronic Packaging Digest. Other news seemed to have the U.S. at the center of the global discussions. My picks start in Phoenix, where TSMC, NVIDIA, and Amkor are all scrambling to establish new capabilities. There’s nothing like a strong demand signal to cause build-out, and AI chips are doing exactly that.
Real Time with... SMTAI 2025: Koh Young's Innovations in SMT Inspection Technology
October 30, 2025 | Real Time with...SMTAI
Joel Scutchfield discusses his background as well as Koh Young's advancements in inspection technology. The conversation covers various inspection systems, including the flagship Zenith 2 system and recent software upgrades.
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Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
October 14, 2025 | Nash Bell, Knocking Down the Bone Pile
Ball grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on...
Global Sourcing Spotlight: Balancing Speed and Flexibility Without Sacrificing Control
October 15, 2025 | Bob Duke, Global Sourcing Spotlight
In global sourcing, speed is a necessity; however, speed without flexibility is a recipe for chaos. Likewise, flexibility without structure leads to inefficiency. Companies thrive when they build agile global sourcing strategies that...
SMT Perspectives & Prospects: Artificial Intelligence Part 6: Data Module 1
October 7, 2025 | Dr. Jennie Hwang, SMT Perspectives and Prospects
Data is one of the six pillars of AI infrastructure. It is critical to the performance of artificial intelligence (AI) models. AI data, essential to both the training and inference of Generative AI models, connotes the datasets used...
Nolan’s Notes: Tariffs, Technologies, and Optimization
October 1, 2025 | Nolan Johnson, Nolan's Notes
Last month, SMT007 Magazine spotlighted India, and boy, did we pick a good time to do so. Tariff and trade news involving India was breaking like a storm surge. The U.S. tariffs shifted India from one of the most favorable trade...
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