Flexible Thinking: Designing Flex Circuits for Dynamic Reliability
Global PCB Connections: Rigid-flex and Flexible PCBs—The Backbone of Modern Electronics
Happy’s Tech Talk #29: Bend-to-Install Semi-flex FR-4
SCHMID Group Announces Agreement for New China Manufacturing Campus to Support Future Growth
SCHMID Group N.V., a global leader in advanced manufacturing solutions for the electronics and semiconductor industries, announced that it has signed...
Insulectro Signs Covestro as Supplier of Advanced Substrates
Insulectro, the largest distributor of materials used in the manufacturing of printed circuit boards and printed electronics, welcomes Covestro as...
PCB Technologies to Exhibit at IMS 2026 in Boston
Issey Ende, VP of Sales and Marketing for PCB Technologies, has announced that the company will be exhibiting at IMS 2026, (IEEE International MTT Symposia) the world’s leading event for the RF, microwave, and...
Flexible PCB Market Size to Hit $88.3 Billion by 2035
The flexible PCB market size was worth $27.12 billion in 2025 and is projected to reach USD 88.3 billion by 2035, growing at a CAGR of 12.52% over...
Will Gutierrez Joins Technica USA in West South-Central Territory
Technica USA is pleased to announce the hiring of Will Gutierrez as Business Development/Account Manager responsible for the West South-Central...
Click Here for More News
Send your news item to: news@iconnect007.com
Click here for press release tips
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
June 5, 2026 | Marcy LaRont, I-Connect007
It’s Friday, the sun is out here in Arizona, and AI is on my mind (and always in the news). So, AI seems like a good place for me to focus this week. My first recommendation for this week is an article I wrote about the e-glass (and copper foil) shortage now plaguing laminate and PCB fabricators as a result of the global market’s very heavy focus on AI-related tech, hardware products, and supporting infrastructure.
Manufacturing Readiness and Scaling Flex–Packaging Integration, Part 4
June 4, 2026 | Anaya Vardya, American Standard Circuits
Parts 1–3 of this series examined the technical foundations, application landscape, and strategic imperatives surrounding the convergence of flexible PCBs and advanced semiconductor packaging. Part 4 turns to the factory floor: What must change in manufacturing processes, equipment, and quality systems to bring this convergence from prototype to production scale?
MORE ARTICLES
Testimonial
"The I-Connect007 team is outstanding—kind, responsive, and a true marketing partner. Their design team created fresh, eye-catching ads, and their editorial support polished our content to let our brand shine. Thank you all! "
