NEDME Returns October 22 — The Northwest’s Premier Design & Manufacturing Expo

The Northwest Electronics Design & Manufacturing Expo (NEDME) returns on Wednesday, October 22, 2025, at Wingspan Event & Conference Center,...
Electronics U Expands Global Workforce Training for the Electronics Industry

The Global Electronics Association unveiled Electronics U, the new name and expanded vision for its workforce training and certification...
American Standard Circuits to Exhibit at SMTA International

Anaya Vardya, President, and CEO of American Standard Circuits/ASC Sunstone Circuits has announced that his company will once again exhibit at SMTA...
Elephantech's SustainaCircuits FPC Adopted for Mass Production in OM Digital Solutions’ Interchangeable Lens

Elephantech Inc. is pleased to announce that its proprietary flexible printed circuits (FPCs) have been adopted for mass production by OM Digital...
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New Course Presents a Comprehensive Guide to IPC Standards
October 10, 2025 | Marcy LaRont, I-Connect007

Francisco Fourcade, electronics technology standards manager for the Global Electronics Association, has spent years helping companies understand and implement the standards that keep the electronics manufacturing industry moving forward. In this interview, he shares updates on ongoing standards development efforts and previews a new course, "IPC Standards: A Guide for the Electronics Industry,” which starts Oct. 14.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
October 10, 2025 | Nolan Johnson, I-Connect007

I-Connect007 has a new monthly digest newsletter, the Advanced Electronic Packaging Digest, and as I was scanning our advanced packaging newsfeeds this week, I came across a primer from tokenring.ai (republished through station WRAL, Raleigh, North Carolina), which I found quite useful. Whether you’re a designer, fabricator, or assembler, the package schemes being developed will change how you work, so be sure to keep your eye on the technological horizon and subscribe to the monthly Advanced Electronic Packaging Digest.
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