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I-Connect007 Editor’s Choice: Five Must-Reads for the Week

October 31, 2025 | Nolan Johnson, I-Connect007

Last week, the IMPACT conference took place in Taipei, bringing together advanced packaging experts from around the globe to share their knowledge. We’ll be bringing you post-conference coverage over the next few weeks, so look for that in our newsletters, and in the Advanced Electronic Packaging Digest. Other news seemed to have the U.S. at the center of the global discussions. My picks start in Phoenix, where TSMC, NVIDIA, and Amkor are all scrambling to establish new capabilities. There’s nothing like a strong demand signal to cause build-out, and AI chips are doing exactly that.

Fresh PCB Concepts: Resilience and Renewal in Domestic PCB Manufacturing

October 30, 2025 | Team NCAB, Fresh PCB Concepts

As veterans of PCB manufacturing, we have spent much of our careers walking factory floors, examining copper circuits under microscopes, and troubleshooting plating lines when they go awry at 2 a.m. We can say with confidence that PCBs are the unsung heroes of modern life. They’re in everything, from toothbrushes and thermostats to satellites and defense systems.

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