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Signal Integrity & Metallization
Signal integrity and additive manufacturing, particularly metallization, are hot topics in PCB design and fabrication. PCB layouts are carefully engineered to achieve specific electrical and power performance targets.
Beyond the Rulebook
What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
March Madness
From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
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Beyond the Board
Column from: Jesse Vaughan
A third-generation Printed Circuit Board (PCB) technologist, Jesse brings a deep-rooted passion and expertise in PCB design, fabrication, assembly and program management. With years of hands-on experience across the entire PCB lifecycle, he has worked closely with engineers, manufacturers, and supply chains to deliver high-quality, reliable solutions. From optimizing complex board designs to streamlining production processes, Jesse excels at bridging the gap between innovation and manufacturability. Committed to advancing PCB technology, he leverages a legacy of industry knowledge as an active member for several IPC committees.