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Below the Surface
Column from: Chandra Gupta
Chandra Gupta is a seasoned leader in advanced ceramic circuit technologies and a driving force behind high-reliability electronics manufacturing. As a senior executive at Remtec, Chandra brings decades of hands-on experience in direct bonded copper (DBC), active metal brazed (AMB), and thick-film ceramic substrates serving aerospace, defense, power electronics, and harsh-environment applications. Known for blending deep technical insight with practical manufacturing discipline, he focuses on scalability, reliability, and customer-driven innovation. Chandra is a frequent industry contributor and speaker, valued for translating complex ceramic circuit challenges into clear, actionable solutions that engineers and OEMs can trust.
March 17, 2026
Below the Surface: From Substrate to System—Why Integration Is the Real RF Breakthrough
In my last column, I described the ceramic substrate itself, and why material choice matters so deeply in RF, microwave, and millimeter-wave applications. Dielectric constant, loss tangent, thermal conductivity, stability across temperature, and frequency are the physical rules that govern whether a signal arrives intact or collapses into noise.February 25, 2026
Below the Surface: Ceramic Circuits—The Most Important Electronics You’ll Never See Working
I decided to write this column to explain, plainly and honestly, how advanced packaging technologies work, and how they help engineers build better products. Ceramic circuits are a good place to start, because they remind us that the most important parts of great electronics are often the ones no one sees, until they’re gone.
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