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Signal Integrity & Metallization
Signal integrity and additive manufacturing, particularly metallization, are hot topics in PCB design and fabrication. PCB layouts are carefully engineered to achieve specific electrical and power performance targets.
Beyond the Rulebook
What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
March Madness
From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
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Below the Surface
Column from: Chandra Gupta
Chandra Gupta is a seasoned leader in advanced ceramic circuit technologies and a driving force behind high-reliability electronics manufacturing. As a senior executive at Remtec, Chandra brings decades of hands-on experience in direct bonded copper (DBC), active metal brazed (AMB), and thick-film ceramic substrates serving aerospace, defense, power electronics, and harsh-environment applications. Known for blending deep technical insight with practical manufacturing discipline, he focuses on scalability, reliability, and customer-driven innovation. Chandra is a frequent industry contributor and speaker, valued for translating complex ceramic circuit challenges into clear, actionable solutions that engineers and OEMs can trust.