Below the Surface

August 13, 2026

Below the Surface: Why Thermal Failure Is Still the No. 1 Killer in Power Electronics

Why do power electronics fail? There’s a range of answers, from overvoltage and mechanical stress to poor assembly and environmental exposure. If you ask your favorite AI search engine for an answer, you’ll get a pretty simple response: excessive temperature leads to component degradation, material breakdown, and eventual failure. In a sense, that’s true, but it’s oversimplified and incomplete. The real issue is thermal management failure at the system level. Heat is still the number one killer, and most of the time, you don’t even realize it’s there.

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August 03, 2026

Below the Surface: Ceramic vs. PCB—When ‘Good Enough’ Becomes System Failure

Let’s start with the question engineers are increasingly asking themselves: “When should I use ceramic instead of FR-4?” It’s a fair question. FR-4 has been the backbone of electronics for decades. It’s affordable, widely available, and for many applications, it works just fine. Until it doesn’t.

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June 22, 2026

Below the Surface: From Nanometers to 10-Gauge—It’s More Than Just a Wire

Modern life runs on wires: your cell phone, your car, the satellites orbiting above us, and even the dryer in your laundry room all depend on the simple idea of moving electricity from one place to another. From nanometer-scale traces etched onto a semiconductor chip to a thick 10-gauge copper wire carrying current to heat your clothes, it’s tempting to say, “It’s just a wire.” But that hides the real story. The magic isn’t the wire itself, but in the materials that insulate, protect, support, and connect it, often under extreme conditions of heat, voltage, vibration, and time.

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May 20, 2026

Below the Surface: Active Component and Module Submounts—The Architecture Behind Performance

If you were to peel back the layers of a modern electronic system, such as a satellite transceiver, a LiDAR module, or a 5G base station, you would not immediately notice a specific component doing some of the most important work. It doesn’t amplify signals, emit light, or process data, yet without it, none of those functions would be stable, reliable, or scalable. That component is the active device submount.

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April 20, 2026

Below the Surface: Looking Ahead to Where Integration Actually Happens

Progress in RF rarely arrives and suddenly rewrites the rules. What actually moves performance forward almost always happens in the seams, the interfaces, the choices that determine whether individual parts are allowed to work together, or forced to fight one another. So, when we look ahead in RF systems—from DC through millimeter-wave—the most important conversations aren’t about isolated materials or heroic devices. They’re about integration, and more specifically, about how ceramic-based RF packages and module architectures shape system-level behavior long before the signal ever reaches free space.

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March 17, 2026

Below the Surface: From Substrate to System—Why Integration Is the Real RF Breakthrough

In my last column, I described the ceramic substrate itself, and why material choice matters so deeply in RF, microwave, and millimeter-wave applications. Dielectric constant, loss tangent, thermal conductivity, stability across temperature, and frequency are the physical rules that govern whether a signal arrives intact or collapses into noise.

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February 25, 2026

Below the Surface: Ceramic Circuits—The Most Important Electronics You’ll Never See Working

I decided to write this column to explain, plainly and honestly, how advanced packaging technologies work, and how they help engineers build better products. Ceramic circuits are a good place to start, because they remind us that the most important parts of great electronics are often the ones no one sees, until they’re gone.

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