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Current IssueThe Hole Truth: Via Integrity in an HDI World
From the drilled hole to registration across multiple sequential lamination cycles, to the quality of your copper plating, via reliability in an HDI world is becoming an ever-greater challenge. This month we look at “The Hole Truth,” from creating the “perfect” via to how you can assure via quality and reliability, the first time, every time.
In Pursuit of Perfection: Defect Reduction
For bare PCB board fabrication, defect reduction is a critical aspect of a company's bottom line profitability. In this issue, we examine how imaging, etching, and plating processes can provide information and insight into reducing defects and increasing yields.
Voices of the Industry
We take the pulse of the PCB industry by sharing insights from leading fabricators and suppliers in this month's issue. We've gathered their thoughts on the new U.S. administration, spending, the war in Ukraine, and their most pressing needs. It’s an eye-opening and enlightening look behind the curtain.
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Estimated reading time: 12 minutes

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More Columns from Happy’s Tech Talk
Happy’s Tech Talk #39: PCBs Replace Motor WindingsHappy’s Tech Talk #38: Novel Metallization for UHDI
Happy’s Tech Talk #37: New Ultra HDI Materials
Happy’s Tech Talk #36: The LEGO Principle of Optical Assembly
Happy’s Tech Talk #35: Yields March to Design Rules
Happy’s Tech Talk #34: Producibility and Other Pseudo-metrics
Happy’s Tech Talk #33: Wet Process Management and Control
Happy’s Tech Talk #32: Three Simple Ways to Manage and Control Wet Processes