-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueSales: From Pitch to PO
From the first cold call to finally receiving that first purchase order, the July PCB007 Magazine breaks down some critical parts of the sales stack. To up your sales game, read on!
The Hole Truth: Via Integrity in an HDI World
From the drilled hole to registration across multiple sequential lamination cycles, to the quality of your copper plating, via reliability in an HDI world is becoming an ever-greater challenge. This month we look at “The Hole Truth,” from creating the “perfect” via to how you can assure via quality and reliability, the first time, every time.
In Pursuit of Perfection: Defect Reduction
For bare PCB board fabrication, defect reduction is a critical aspect of a company's bottom line profitability. In this issue, we examine how imaging, etching, and plating processes can provide information and insight into reducing defects and increasing yields.
- Articles
- Columns
- Links
- Media kit
||| MENU - pcb007 Magazine
Insulectro Brings Power Chats to Booth at IPC APEX EXPO 2016
March 14, 2016 | InsulectroEstimated reading time: 4 minutes
TUESDAY, MARCH 15
10:30 am Printed Electronics 101
Want to learn about Printed Electronics? Give us 13.5 minutes.
Chris Hunrath, Insulectro
11:30 am Tune into High Frequency with Tachyon 100G
Isola’s process friendly low loss, high reliability laminate system.
Norm Berry, Insulectro
1:30 pm Pyralux HT Can Take the Heat
Highest temperature PCB material system available @ 225°C
Glenn Oliver, DuPont & Michelle Walsh
2:00 pm Work Out Your Core with Interra™ FL
Fine lines and low loss layers with high copper adhesion
Glenn Oliver, DuPont & Chris Hunrath, Insulectro
3:00 pm Challenged by High Temperature Lamination?
Take the pressure off with Thermolam™
Combination high temperature conformal and release up to 315°C
Peter Decaneas, Pacothane & Chris Hunrath, Insulectro
3:30 pm Better Bonds, better Profiles, Don’t Let Your Design Get Foiled
Copper foil bond enhancements from Oak Mitsui
John Blaber, Oak-Mitsui & Joe Bevan, Insulectro
WEDNESDAY, MARCH 16
10:30 am Jump on Board and Catch the Design Wave
All about Ormet interconnects.
James Haley, EMD Performance Materials & Chris Hunrath, Insulectro
11:00 am Get Stuck on GliCap
Shikoku’s non-etching innerlayer bonding process
Koji Saeki, Shikoku & Mike Gemanis, Insulectro
1:30 pm Challenged by High Temperature Lamination?
Take the pressure off with Thermolam™
Combination high temperature conformal and release up to 315°C
Peter Decaneas, Pacothane & Chris Hunrath, Insulectro
2:00 pm Tune into High Frequency with Tachyon 100G
Isola’s process friendly low loss, high reliability laminate system.
Norm Berry, Insulectro
2:30 pm Get Out of the Rough and Ditch Pumice Scrub with Glibrite
Shikoku’s copper adhesion process for dry film and soldermask.
Koji Saeki, Shikoku & Chris Hunrath, Insulectro
3:00 pm Focus In on High Yield Imaging Processes
Photoresist matched process chemistries by Focus Tech
Scott Campbell, Focus Tech & Michelle Walsh, Insulectro
3:30 pm Wet Lam to the Rescue on VLP Copper
Process for high yields on fine line innerlayers with VLP copper
William Wilson, DuPont & Mike Gemanis, Insulectro
4:00 pm Pyralux HT Can Take the Heat
Highest temperature PCB material system available @ 225°C
Glenn Oliver, DuPont & Michelle Walsh, Insulectro
THURSDAY, MARCH 17
10:30 am Printed Electronics 101
Want to learn about Printed Electronics? Give us 13.5 minutes.
Chris Hunrath, Insulectro
11:30 am Work Out Your Core with Interra™ FL
Fine lines and low loss layers with high copper adhesion
Glenn Oliver, DuPont & Chris Hunrath, Insulectro
All Power Chats are in Space 534 at IPC APEX EXPO. No sign-up required. For further information, please phone 949-587-3326.
About Insulectro
Insulectro is the leading supplier of PCB and Printed Electronics materials used to manufacture circuit boards. Insulectro combines its premier product offering with local inventory in strategic stocking locations across the country, fabrication capabilities and backed up by expert customer and technical support services.
Insulectro supplies advanced engineered materials manufactured by DuPont®, Isola, LCOA®, CAC, Inc., Pacothane, Oak-Mitsui, Focus Tech, Shikoku, Kodak, and Coveme. These products are used by our customers to fabricate complex, multilayer circuit boards. Insulectro serves a broad customer base manufacturing rigid, rigid/flex and flexible circuit boards and printed electronics for applications in a variety of end markets including telecom, data communications, high speed computing, mobile devices, military, and medical.
Page 2 of 2Suggested Items
Lockheed Martin Revolutionizes Maritime Surveillance with AI-Powered Technology
07/21/2025 | Lockheed MartinLockheed Martin has achieved a major breakthrough in AI and airborne surveillance with the potential to detect and track maritime targets with unprecedented accuracy.
Delta Electronics (Thailand) Hosts 'Delta ESG Forum 2025' to Chart the Course for a More Sustainable and Inclusive Thailand
07/21/2025 | Delta ElectronicsDelta Electronics (Thailand) PCL., a global leader in power management and smart green solutions, today held its Delta ESG Forum 2025 under the theme “Collaborating for a Sustainable Thailand”.
NOTE’s CEO Sells 12,000 Shares – Remains as Major Shareholder
07/21/2025 | NOTENOTE's CEO Johannes Lind-Widestam has recently sold 12,000 shares in NOTE, corresponding to 3,7% of his holdings, to a value of SEK 2.3 million. The sale was carried out to cover tax obligations.
Saab Q2 2025 Results: Accelerating Growth and Strengthening our Market Position
07/21/2025 | SaabOrder intake for the second quarter amounted to SEK 28,403m (39,574), driven by strong growth in small and medium-sized orders.
SEMI Foundation Launches NSF-Powered National Call for Applicants of Regional Nodes
07/21/2025 | SEMIThe SEMI Foundation is thrilled to announce the launch of the application process for organizations seeking to become Regional Nodes in the National Network for Microelectronics Education (NNME), a nationwide initiative funded by the U.S. National Science Foundation and supported by the U.S. Department of Commerce that aims to advance education, training, and employment pathways in the U.S. microelectronics sector.