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December 30, 2014
At #3, Tin Whisker Risk Management by Conformal Coating, by Linda Woody and William Fox, Lockheed Martin Missiles and Fire Control: This study was designed to examine the effects of tin whisker growth on three coatings--acrylic, polyurethane, and parylene--applied to test coupons at varying thicknesses. In addition, the tin whisker growth on braiding, stranded wire, and solid single strand wire with pure tin coating was also monitored to determine the risk of use in high-reliability products.
At #2, Advanced Thermal Management Solutions on PCBs for High-Power Applications, by G. Langer & M. Leitgeb, AT&S AG; J. Nicolics & M. Unger, Vienna University of Technology; H. Hoschopf, Tridonic Jennersdorf; and F.P. Wenzl, Institute for Surface Technologies & Photonics: With increasing power loss of electrical components, the thermal performance of an assembled device becomes one of the most important quality factors in electronic packaging. Due to the rapid advances in semiconductor technology the temperature dependence of long-term reliability is a critical parameter and has to be considered with the highest possible care during the design phase.
And, at the #1 spot, Printed Electronics: Traditional Processes Enabling Next-generation Electronics, by Sumit Kumar Pal, Frost & Sullivan: In electronics, most R&D has traditionally focused on developing novel technologies that can have either incremental or path-breaking benefits. However, printed electronics is an example of how an established technology finds new applications due to innovation in diverse fields of study.Page 2 of 2
Top 10 SMT Tech Tuesday Articles of 2014
At #3, Tin Whisker Risk Management by Conformal Coating, by Linda Woody and William Fox, Lockheed Martin Missiles and Fire Control: This study was designed to examine the effects of tin whisker growth on three coatings--acrylic, polyurethane, and parylene--applied to test coupons at varying thicknesses. In addition, the tin whisker growth on braiding, stranded wire, and solid single strand wire with pure tin coating was also monitored to determine the risk of use in high-reliability products.
At #2, Advanced Thermal Management Solutions on PCBs for High-Power Applications, by G. Langer & M. Leitgeb, AT&S AG; J. Nicolics & M. Unger, Vienna University of Technology; H. Hoschopf, Tridonic Jennersdorf; and F.P. Wenzl, Institute for Surface Technologies & Photonics: With increasing power loss of electrical components, the thermal performance of an assembled device becomes one of the most important quality factors in electronic packaging. Due to the rapid advances in semiconductor technology the temperature dependence of long-term reliability is a critical parameter and has to be considered with the highest possible care during the design phase.
And, at the #1 spot, Printed Electronics: Traditional Processes Enabling Next-generation Electronics, by Sumit Kumar Pal, Frost & Sullivan: In electronics, most R&D has traditionally focused on developing novel technologies that can have either incremental or path-breaking benefits. However, printed electronics is an example of how an established technology finds new applications due to innovation in diverse fields of study.Page 2 of 2
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