Share on:

Share on LinkedIn Share on X Share on Facebook Share with email


Advanced Electronics Packaging Digest

Subscribe

Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

Subscribe now to stay informed, competitive, and connected.

Suggested Items

NOTE Finland Joins PIA to Strengthen Defense Industry Collaboration

11/09/2026 | NOTE
NOTE Finland provides electronics manufacturing services ranging from prototypes to series production, including PCBAs and complete box-build products.

SCHMID Wins Wet-Process Equipment Order for South Asia’s First Glass Core Facility

11/09/2026 | SCHMID Group
Order marks an important step on the industry’s path from pilot lines to volume manufacturing of glass core substrates for AI and high-performance computing.

onsemi, Czech Ministry Agree to End SiC Expansion Project

11/09/2026 | onsemi
onsemi and the Czech Ministry of Industry and Trade confirmed that they will not proceed with the planned expansion to add end-to-end silicon carbide (SiC) production at onsemi's Rožnov pod Radhoštěm site, first announced in June 2024.

Teledyne Brown Wins Next Generation Interceptor Support Equipment Subcontract

11/09/2026 | BUSINESS WIRE
Teledyne Brown Engineering, Inc., a subsidiary of Teledyne Technologies Incorporated and a leader in advanced engineering and manufacturing solutions, was awarded a sub-contract by Lockheed Martin in support of the Next Generation Interceptor (NGI) mission. Under the award, Teledyne will deliver NGI mechanical ground support equipment to Lockheed Martin.

Qnity Showcases Next-Generation Electronics Solutions at electronica 2026

11/09/2026 | Qnity
Qnity Electronics, Inc., a premier technology solutions leader across the semiconductor value chain, will showcase a portfolio of advanced materials and solutions designed to address growing thermal, power, connectivity and reliability demands across AI infrastructure, semiconductor manufacturing, automotive and high-performance computing applications at electronica 2026.
Copyright © I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in