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Indium Corporation® Assistant Product Manager Foo Siang Hooi will discuss the critical factors that influence the performance of compressible metal thermal interface materials (TIMs) and their role in addressing the demands of next-generation cooling applications at TestConX China, October 29, in Suzhou, China.
The presentation, titled Beyond Thermal Conductivity: What Really Matters for Compressible Metal TIMs, investigates factors beyond thermal conductivity that influence the performance of compressible indium-based metal TIMs. Installation time, applied pressure, material thickness, and pattern geometry are all examined to demonstrate how plastic deformation, interfacial resistance, and surface conformity affect thermal resistance. The session will provide practical guidance for optimizing TIM configurations and assembly conditions to improve thermal performance and long-term reliability in AI accelerators, data center hardware, and power electronics.
Foo Siang Hooi is an assistant product manager at Indium Corporation, where he plays a pivotal role in driving business development and expansion efforts for engineered solder products throughout Asia. His responsibilities include delivering technical and commercial training on application technologies and products and ensuring a comprehensive understanding for clients and stakeholders. Foo earned a bachelor’s degree in electronics engineering from Multimedia University in Malaysia. He holds a Six Sigma Green Belt certification and is ISO 9000-certified.
