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Advanced Electronics Packaging Digest

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Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

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What Scares Me Today in PCB and System Design

10/28/2026 | Stephen V. Chavez, Siemens EDA and PCEA
After more than 30 years in PCB design, I have seen our industry evolve from relatively straightforward circuit boards to highly complex, high-density, high-speed electronic systems that push the limits of physics, materials, manufacturing processes, and engineering capabilities. I have worked across multiple design disciplines, tackled difficult technical challenges, and watched the tools and technologies available to engineers advance dramatically.

New Meet the Author Episode Explores Direct Metallization in Advanced PCB Manufacturing

10/28/2026 | I-Connect007
I-Connect007 is pleased to announce the release of its latest Meet the Author podcast episode, featuring Carmichael Gugliotti, Line of Business Director for Primary Metallization at MacDermid Alpha Electronics Solutions and author of The Printed Circuit Designer’s Guide to Direct Metallization: A Guide to Complex PCB Fabrication. As PCB designs become increasingly complex, fabricators face growing pressure to deliver higher performance while reducing process complexity, resource consumption, and waste. Direct metallization, a technology with decades of history, is gaining renewed attention as manufacturers seek more efficient and sustainable approaches to PCB production.

Technica USA to Attend SEMICON West 2027, Expanding Presence in the Semiconductor Market

10/26/2026 | Technica USA
Technica USA recently attended the SEMICON West Expo, where company representatives Jason Perry, President; Peter Chen, Equipment Service Manager; and Frank Medina focused on strengthening relationships with customers and supply partners while preparing for the company’s participation in SEMICON West 2027 that will take place March 30-April 1, in Phoenix, Arizona.

3 Key Takeaways: Understanding the Promise and Practical Limits of ELIC

10/26/2026 | I-Connect007
As semiconductor packages become smaller and more complex, PCB designers face increasing pressure to accommodate higher interconnect densities within tighter space constraints. Every layer interconnect (ELIC) technology offers a way to overcome some of the limitations of traditional HDI construction, but achieving greater density introduces new challenges in fabrication, reliability, and cost. In his white paper, ELIC: Every Layer Interconnect—The Promise, the Pain, and the Practical Limits, ASC President and CEO Anaya Vardya examines the advantages of ELIC architecture, the manufacturing challenges that accompany it, and the design decisions that determine whether a board can be produced reliably at scale.

Flex Connections: Is a Printed Silver Ink Circuit Right for Your Application?

10/27/2026 | Terrill Schmidt -- Column: Flex Connections
When is the right time to design a flexible circuit with printed ink, usually silver, vs. a flexible etched copper circuit, a die-cut copper circuit, or a die-cut aluminum circuit? First, a flexible circuit design must work in the application as designed and be cost-effective so the end product can be sold or used. What drives a designer to choose between an etched copper circuit, printed ink, flat flexible cable, die-cut copper, or die-cut aluminum? Multiple factors influence the design.
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