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Advanced Electronics Packaging Digest

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Infineon to Build Europe’s First 300mm GaN Power Semiconductor Fab

10/27/2026 | Infineon
Infineon Technologies AG is establishing the world’s first high-volume manufacturing facility for next-generation gallium nitride (GaN) power semiconductors on 300-millimeter wafers in Europe.

Global Electronics Association East Asia Awards Recognize Industry Leadership and Talent Development

10/27/2026 | Global Electronics Association
Global Electronics Association East Asia recognizes the individuals and organizations making meaningful contributions to the electronics industry through its East Asia Awards.

Kontron Expands U.S. Defense Manufacturing with VX307H Production in Huntsville

10/26/2026 | Kontron
Kontron, a global leader in IoT and Embedded Computing Technology, today announced the first U.S. production of its rugged VX307H 3U VPX compute platform at Nextek, a Kontron company, in Huntsville, Alabama. Customers can now choose a VX307H built in the USA with Global Components.

3 Key Takeaways: Understanding the Promise and Practical Limits of ELIC

10/26/2026 | I-Connect007
As semiconductor packages become smaller and more complex, PCB designers face increasing pressure to accommodate higher interconnect densities within tighter space constraints. Every layer interconnect (ELIC) technology offers a way to overcome some of the limitations of traditional HDI construction, but achieving greater density introduces new challenges in fabrication, reliability, and cost. In his white paper, ELIC: Every Layer Interconnect—The Promise, the Pain, and the Practical Limits, ASC President and CEO Anaya Vardya examines the advantages of ELIC architecture, the manufacturing challenges that accompany it, and the design decisions that determine whether a board can be produced reliably at scale.

Nano Dimension Opens Essemtec U.S. Headquarters Amid Strong Demand

10/26/2026 | Nano Dimension
Nano Dimension Ltd. announced that its Essemtec business unit has relocated its U.S. headquarters to a new facility in Woburn, Massachusetts, reinforcing its established presence in the United States and supporting its continued business growth.
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