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Trouble in Your Tank: Are PCB Fabricators Ready for the Next Technology Curve?
Silicon carbide (SiC) and gallium nitride (GaN) power devices are expanding their role in electronics, with implications extending beyond component selection to product design, manufacturing capability and supply-chain planning, according to new research from the Global Electronics Association and Accuris, a provider of engineering intelligence and electronic-component data.
The research examines the growing adoption of these technologies in products and infrastructure that require greater energy efficiency, compact designs and reliable power performance, including electric vehicles, renewable-energy systems, AI data centers, communications infrastructure and consumer electronics.
Drawing on data from the Accuris Parts Database and manufacturing insight, the research highlights how SiC and GaN are changing product-development, sourcing and printed circuit board requirements. The findings underscore the importance of evaluating these technologies early in design and planning, when decisions about performance, materials and production processes can also affect reliability and supply continuity.
“Wide-bandgap power technologies have moved beyond a specialized engineering conversation,” said Mike Carano, industry intelligence consultant, Global Electronics Association. “They are now a business and supply-chain consideration for companies across the electronics ecosystem. As demand grows for more efficient and higher-performing electronic systems, it is essential that designers, manufacturers and sourcing teams understand not only where these technologies are being adopted, but also what their use means for production capability, reliability and supply continuity.”
SiC and GaN are not interchangeable technologies. SiC is gaining traction in high-voltage, high-power applications, while GaN is increasingly used where high switching speed and compact power conversion are especially important. These differences mean organizations must align technology choices with application requirements—and account for those choices in design, sourcing and manufacturing planning.
“Parts data provides a valuable signal of where technology adoption is heading, but the most important question for the industry is what those trends mean in practice,” said Greg Jaknunas, senior director of product development, Accuris. “This report connects component-market data with the realities of electronics production, helping companies make more informed decisions as they manage performance targets, lifecycle risk and supply-chain resilience.”
The research also highlights the growing importance of collaboration across the electronics value chain. As power devices evolve, the implications extend to board design, materials, fabrication processes, thermal management, component availability and end-product reliability. Considering these factors together can help companies bring next-generation power systems to market efficiently and reliably.
The findings are detailed in SiC and GaN Power Devices Are Expanding — What the Parts Data (and the Fab Floor) Tell Us, authored by Greg Jaknunas of Accuris and Mike Carano of the Global Electronics Association. It is the first in a planned joint white paper series examining technology and market developments relevant to electronics manufacturers, designers, suppliers and customers worldwide.
The full report is available at https://www.electronics.org/galliumsilicon-carbide-white-paper.
