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Advanced Electronics Packaging Digest

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Suggested Items

SEHO Introduces SelectLine-S: German Engineering for the Asian Electronics Market

10/22/2026 | SEHO Systems GmbH
SEHO Systems GmbH will introduce the SelectLine-S, a new selective soldering machine, at NEPCON Shenzhen 2026, taking place October 27–29 in Shenzhen, China.

ICT 2026 Annual Symposium Review (Part 2): Solving Complex Manufacturing Challenges

10/23/2026 | Pete Starkey, FInstCT
A logical follow-on from the discussion of AI infrastructure was a practical example of AI applications in a PCB manufacturing environment. Oliver Cleveley-Jones and his colleagues Patrick Brown and Sam Hair from Alpha Machines described the development and benefits of an AI-driven integrated digital-twin architecture, and what it looks like from the inside of a working factory. 

From IPC Standards to Practical DFM

10/21/2026 | Marcy LaRont, I-Connect007
DFM seems like common sense: If we know the rules a PCB must meet, why not check the design against them before it ever reaches the factory? In practice, of course, it’s not quite that simple. I caught up with Susan Kayesar, product manager at Siemens and longtime contributor to Global Electronics Association standards activities, to talk about an ongoing effort between Siemens and the Association to translate IPC requirements into practical, software-based DFM checks.

Omega EMS Expands Advanced Inspection Capabilities with New 3D AOI and X-Ray Systems

10/16/2026 | Omega EMS
Investment delivers inline 3D optical inspection across all San Jose SMT production lines and doubles 3D X-ray inspection capacity.

Foxconn, Mitsubishi Electric Finalize Automotive Equipment Alliance

10/16/2026 | Foxconn
Through the alliance, the companies aim to develop next-generation mobility and thereby strengthen the sustainable growth of the Japanese automotive industry.
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