Zhen Ding: AI Reshapes High-End PCB Competition

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Zhen Ding Technology Holding Limited, a global leader in PCB manufacturing, participated in the “TPCA Show Trends Forum” at the 2026 TPCA Show. Zhen Ding's General Manager Jeff Chien joined senior executives from leading international materials supplier Qnity and equipment manufacturer KLA in a panel discussion titled “From Technological Innovation to Global Mass Production: Strengthening Supply Chain Resilience in the AI Era,” sharing insights on key trends shaping the advanced PCB industry amid the rapid growth of AI.

Jeff Chien noted that as AI infrastructure continues to expand rapidly, advanced PCBs are evolving toward higher transmission speeds, greater interconnect density, and increasingly complex manufacturing processes. Looking ahead, competition in the industry will be defined not only by technological capabilities and production scale, but also by smart manufacturing efficiency, global mass production capabilities, and supply chain integration. The ability to quickly translate technological breakthroughs into scalable production with consistent quality, high yields, and reliable delivery will be a key determinant of long-term competitiveness.

Jeff Chien said that Zhen Ding has long been committed to advancing PCB technologies and smart manufacturing. The company currently operates 28 plants across mainland China, Thailand, and Kaohsiung, with another 22 plants under construction and 9 additional plants in the planning stage. All new plants will be developed with a focus on advanced automation, digitalization, and AI-enabled smart manufacturing. Zhen Ding was the first PCB manufacturer to adopt the semiconductor industry's SECS/GEM equipment communication standards, with implementation covering 150 suppliers, more than 1,000 equipment types, and over 5,000 machines, establishing a highly standardized digital manufacturing system. The company continues to integrate AI into equipment monitoring, early warning systems, yield analysis, and production management, with certain AI applications already reducing task time by up to 90%. By leveraging AI and big data analytics, Zhen Ding is further enhancing process management efficiency and accelerating new product introductions and yield ramp-ups at new plants, translating its smart manufacturing capabilities into greater production efficiency, higher output per employee, and stronger profitability.

Jeff Chien further highlighted that technological challenges in the AI era increasingly span multiple areas, including materials, equipment, and manufacturing processes, making collaborative R&D and supply chain integration more important than ever. In July this year, Zhen Ding hosted its Global Supplier Conference, bringing together 247 suppliers and more than 400 representatives, demonstrating the company's strong integration capabilities across the global PCB supply chain. By deepening collaboration with key materials suppliers, equipment partners, and academic and research institutions throughout technology development, process validation, and mass production, Zhen Ding aims to accelerate the commercialization of new technologies while strengthening access to critical resources. These efforts will further reinforce its competitive advantages and supply chain resilience as advanced PCB technologies evolve and supply chains become increasingly complex.

In addition, Zhen Ding continues to strengthen industry-academia collaboration through the establishment of the “Advanced PCB Talent Development Program” with National Central University, the “Zhen Ding-Tsing Hua Joint Research Center” at National Tsing Hua University, and the “Green AIPCB Collaborative Laboratory” with Chung Yuan Christian University. These initiatives bring together academic research and industry expertise to advance technology development and cultivate interdisciplinary talent. Chien emphasized that as advanced PCB manufacturing processes become increasingly complex, demand will continue to grow for professionals with expertise spanning manufacturing processes, data analytics, and AI applications. Through joint research platforms and talent development initiatives, Zhen Ding aims to further strengthen its innovation capabilities and build a solid foundation for long-term growth.

Against the backdrop of continued global AI infrastructure expansion and supply chain restructuring, Chien noted that Zhen Ding is leveraging its “One ZDT, One Team” strategy to extend the process expertise, quality standards, and smart manufacturing capabilities of its established production bases to new plants worldwide. By combining digital management systems with local support from supply chain partners, the company aims to accelerate the ramp-up of new capacity and achieve stable mass production. Looking ahead, Zhen Ding will continue to strengthen its “One ZDT” platform advantages and capitalize on growth opportunities in advanced applications, including AI servers, high-speed optical modules, IC substrates, and edge AI. By integrating technology advancements, smart manufacturing, and global capacity expansion, the company aims to translate the growing opportunities in the advanced PCB market into sustained revenue and earnings growth.