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Advanced Electronics Packaging Digest

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Siemens, NVIDIA Expand Agentic AI Collaboration for 3D IC Power and Thermal Design

10/21/2026 | Siemens
Siemens announced an expansion of its EDA agentic AI portfolio, developed in collaboration with NVIDIA.

NVIDIA, Supply Chain Partners Expand Capacity to Accelerate AI Infrastructure Buildout

10/21/2026 | Globe Newswire
NVIDIA announced plans with a group of supply chain partners to expand global manufacturing capacity to meet growing demand for its accelerated computing and full-stack AI factory platform.

Mercedes-Benz, NVIDIA Expand Partnership on Automated Driving

10/19/2026 | NVIDIA
Mercedes-Benz and NVIDIA announced that they will extend their strategic partnership to advance the next generation of automated driving systems.

Siemens Advances AI Chip Lithography with NVIDIA cuLitho

10/15/2026 | Siemens
Siemens announced significant advances in its collaboration with NVIDIA to accelerate computational lithography workflows.

NVIDIA, Chipmakers Advance AI-Defined Fab Design and Manufacturing

10/15/2026 | Globe Newswire
NVIDIA announced semiconductor leaders are adopting NVIDIA CUDA-X™ libraries — including the new NVIDIA cuPotential library, which developers can use to build AI agents that simulate how atoms and molecules interact — to advance AI-defined fabs.
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