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From Wafer-level Inspection to System-level Scaling: A Preview of the November Advanced Electronics Packaging Digest

11/11/2026 | I-Connect007 Editorial Team
From wafer-level inspection and precision dispensing to interconnected computing architectures and electronics designed for extreme environments, the November issue of Advanced Electronics Packaging Digest (AEPD) explores how increasing complexity is driving new approaches to performance, reliability, and process control.

Built to Survive: Drones—Designed for the Mission

11/10/2026 | Cody Schoener -- Column: Built to Survive
We've grown accustomed to seeing drones used for photography, inspection, entertainment, and spectacular coordinated light shows. Today, drones are being designed for a much broader range of missions, including demanding military and defense applications. That creates a very different electronics challenge.

Real Time with... SMTAI 2026: Exploring Bath Life and the True Cost of Cleaning With Dr. Adam Klett

11/10/2026 | Real Time with...SMTAI
KYZEN's Dr. Adam Klett examines why cleaning bath life alone does not measure process performance or cost.  During this interview from the recent SMTA International event, he discusses process control and modeling tools that help manufacturers evaluate chemistry consumption, drag out, evaporation, and equipment settings to optimize cleaning performance and overall operating cost.

EV Group Advances Qubit Scaling Through Advanced Packaging

11/09/2026 | PRNewswire
EV Group (EVG), a leading provider of innovative process solutions and expertise serving leading-edge and future semiconductor designs and chip integration schemes, announced that it is supporting quantum chip developers and manufacturers in addressing the complex manufacturing requirements associated with scaling quantum computing systems.

SCHMID Wins Wet-Process Equipment Order for South Asia’s First Glass Core Facility

11/09/2026 | SCHMID Group
Order marks an important step on the industry’s path from pilot lines to volume manufacturing of glass core substrates for AI and high-performance computing.
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