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Fujifilm, ePac Flexible Packaging Announce Global Strategic Partnership

10/20/2026 | BUSINESS WIRE
Fujifilm announces a global strategic alliance with ePac Flexible Packaging, an international leader in digitally driven flexible packaging solutions.

Enabling the Interconnect Technologies That Transform Our World: MKS’ Strategic Role in Powering the Future of AI and HPC

10/20/2026 | John T.C. Lee, with Won Lee, Marc Tricard, and Kuldip Johal
AI is reshaping industries, economies, and daily life at an unprecedented speed. From generative AI and autonomous systems to high-performance computing (HPC) applications in science, defense, and advanced manufacturing, the demand for computational power is accelerating exponentially. But while algorithms capture the spotlight, the true enabler of this transformation lies deeper, in the physical infrastructure that makes AI possible. Performance in the AI era is no longer defined by transistor shrink alone. It is increasingly defined by how efficient systems are integrated, interconnected, cooled, and manufactured at scale.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

10/16/2026 | Michelle Te, I-Connect007
Working from home really has its perks, especially when it comes to driving. I don’t miss the commute time, driving in the rain, or having to maneuver around everyone else going to work or coming home. Simply popping up to my desk in the morning is such a benefit. But what I do miss is being physically with my coworkers and the interactions that can happen when you’re all together. You just don’t get the synergy over a Teams call that you can get in person. Even more, being together fosters a sense of camaraderie you can’t get any other way.

The Good News in the PCB Market Outlook

10/16/2026 | Marcy LaRont, I-Connect007
There’s plenty of good news in the PCB market right now, but Dr. Hayao Nakahara cautions against taking the growth numbers entirely at face value. Higher prices for memory and scarce materials are helping drive some impressive financial results, even as order volumes tell a somewhat different story. At the same time, AI servers and advanced packaging are creating opportunities that could reshape where PCB manufacturers invest next.

From Substrates to Systems: A Preview of the October Advanced Electronics Packaging Digest

10/14/2026 | I-Connect007
The October issue of Advanced Electronics Packaging Digest examines the technologies, investments, and strategic decisions shaping the future of advanced electronics manufacturing. From the evolution of semiconductor scaling and the integration challenges of high-frequency systems to the expansion of semiconductor capabilities in the United States and India, this issue explores how materials, packaging architectures, and manufacturing infrastructure are becoming interconnected.
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