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Nordson Test & Inspection, a global leader in inspection, metrology, and testing solutions, will showcase its comprehensive portfolio of industry-leading optical, X-ray, acoustic inspection, and metrology technologies powered by the Nordson Intelligence™ Ecosystem at SEMICON Europe 2026, November 10-13, in Booth B1.101 at the Messe München, Germany.
Highlighting the exhibition will be the worldwide debut of the new SonoFlex™ Acoustic Microscopy Inspection (AMI) System, an innovative platform designed to redefine acoustic inspection performance for back-end advanced semiconductor manufacturing.
Combining breakthrough ThruScan imaging technology with intelligent AI-powered analytics, SonoFlex delivers exceptional image quality, highly accurate defect detection, and significantly increased throughput for small-panel applications. The system incorporates advanced pulser and transducer technologies that enable scanning speeds up to twice as fast as conventional solutions while maintaining high-resolution imaging performance.
Its modular architecture simplifies maintenance and serviceability while enabling scalable multi-system configurations capable of increasing throughput by up to eight times. Powered by FlexCore™ software and Nordson’s N-Intelligence Multi-Gate Image Analysis (MGIA) technology, SonoFlex automatically identifies defects, isolates true void counts, and supports complex device and process analysis. The result is improved product quality, greater manufacturing efficiency, and deeper process insight through advanced acoustic inspection and imaging capabilities.
In addition to SonoFlex, Nordson will showcase a broad range of advanced inspection and metrology solutions designed to enhance yield, process control, and productivity across front-end, mid-end, and back-end semiconductor manufacturing operations.
The Quadra® 7 Pro establishes a new benchmark for 2D and 3D manual X-ray inspection in semiconductor back-end manufacturing. Equipped with Nordson’s industry-leading Onyx® detector and Dual Mode Quadra NT4® X-ray tube, the system enables seamless switching between brightness and high-resolution imaging modes, providing operators with unmatched flexibility and image clarity across a wide range of inspection applications.
The high-quality frame is built to last, with a rugged design to ensure years of smooth operation. Industry Standard Production Bond Testing STELLAR 4000 for all manually operated pull and shear production bond testing. Configure as a simple bond wire pull tester, or upgrade for ball shear, die shear, bump pull, and tweezer pull testing. STELLAR 4000 incorporates Nordson core technology and is fully compatible with existing 4000 load cartridges.
Semiconductor Front-End Solutions Demonstrated
Nordson will also demonstrate its WaferSense® AGS2 and ACS wireless metrology sensors designed for capturing and analyzing real-time data for effective semiconductor tool set-up and maintenance. The ACS “sees” inside equipment to capture dimensional offset data (x,y and z) to quickly center wafer transfer positions. The AGS2 speeds non-contact gap measurements and parallelism adjustments under vacuum, improving uniformity, tool availability and repeatability in a thinner and lighter form-factor.
Connected AOI & AXI Inspection at Nordson Booth C2.429
Powered by Nordson Sight, AOI and AXI systems communicate seamlessly, connecting inspection data across processes to provide a unified view of quality, faster root-cause analysis, and improved manufacturing performance.
Nordson Sight supports applications ranging from individual machines to complete factory-wide deployments. Its efficient architecture enables manufacturers to manage increasing data volumes across multiple inspection systems while maintaining fast performance, reliable reporting, and consistent data integrity.
Discover how SQ5000Pro AOI and AXI XS with Dynamic Planar CT work together through Nordson SIGHT to create a fully connected inspection workflow.
SQ5000Pro AOI delivers high-speed, high-accuracy inspection with advanced MRS® technology, enabling reliable inspection of advanced packaging, SMT, 0201 metric, socket metrology and semiconductor applications.
AXI XS with Dynamic Planar CT, (DPCT) provides exceptional image quality, superior defect visibility, enhanced layer separation, and faster throughput for demanding applications such as flip-chip and micro-bump inspection. Utilizing a new reconstruction algorithm, Dynamic Planar CT delivers superior image quality, enhanced layer separation, and exceptional defect visibility.
Seamless communication between the SQ5000Pro AOI and AXI XS enables intelligent defect verification, faster troubleshooting, and a unified quality view across the manufacturing process, helping customers improve yield and reduce inspection time.
AI Across Semiconductor Landscape
As part of its expanding Nordson Intelligence™ Ecosystem, Nordson continues to advance the application of machine learning, deep learning, and artificial intelligence across inspection and metrology platforms. Visitors will experience how these intelligent technologies are helping manufacturers accelerate process optimization, improve defect classification, and drive higher production yields.
Visit Nordson Test & Inspection in Booth B1.101 & C2.429 to experience live demonstrations and discover how Nordson’s innovative inspection, metrology, and test solutions are helping semiconductor manufacturers improve yields, optimize processes, and increase productivity across the industry.
