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Suggested Items

The Clean Truth: The Clean Truth About No-Clean Flux

10/14/2026 | Dr. Adam Klett -- Column: The Clean Truth
One of the most misunderstood terms in electronics manufacturing is “no-clean flux.” It sounds simple enough: Use the flux, complete the soldering process, and, best of all, you don’t have to clean. Unfortunately, that interpretation has led to decades of confusion and, in some cases, preventable reliability problems.

Draper Breaks Ground on New Microelectronics Building in Lowell

10/14/2026 | Draper Laboratory
Draper recently held a groundbreaking ceremony for a new microelectronics building in Lowell, Massachusetts. The building will house Draper's Integrated Microelectronics Production & Advanced Chip Technology (IMPACT) Center.  

ComEd, Richardson Electronics Expand Illinois Battery Storage Project

10/14/2026 | Richardson Electronics, Ltd.
ComEd and Richardson Electronics, Ltd. joined state and industry leaders to announce Richardson Electronics’ expanded manufacturing of locally produced battery energy storage systems and plans to install its first onsite battery energy storage system demonstration project.

Sypris Receives Follow-On Award for Mission-Critical U.S. Navy Program Share

10/14/2026 | Sypris Electronics LLC
Sypris Electronics, LLC, a subsidiary of Sypris Solutions, Inc., announced that it has received a follow-on award to manufacture and test electronic power supplies for a large, mission-critical U.S. Navy program.

From Substrates to Systems: A Preview of the October Advanced Electronics Packaging Digest

10/14/2026 | I-Connect007
The October issue of Advanced Electronics Packaging Digest examines the technologies, investments, and strategic decisions shaping the future of advanced electronics manufacturing. From the evolution of semiconductor scaling and the integration challenges of high-frequency systems to the expansion of semiconductor capabilities in the United States and India, this issue explores how materials, packaging architectures, and manufacturing infrastructure are becoming interconnected.
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