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Advanced Electronics Packaging Digest

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Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

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Incap, Rantelon Partner on RF and Electronic Warfare Technologies for Unmanned Systems

11/12/2026 | Incap
Incap Electronics Germany GmbH and Rantelon OÜ are establishing a sales and business development cooperation to bring advanced radio-frequency and electronic warfare technologies to manufacturers and developers of unmanned systems in the German-speaking market.

SEL Names New VP of Marketing and SEL University

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3 Key Takeaways: Why Advanced Materials Are Shaping the Future of Electronics

11/10/2026 | I-Connect007
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Teledyne Brown Wins Next Generation Interceptor Support Equipment Subcontract

11/09/2026 | BUSINESS WIRE
Teledyne Brown Engineering, Inc., a subsidiary of Teledyne Technologies Incorporated and a leader in advanced engineering and manufacturing solutions, was awarded a sub-contract by Lockheed Martin in support of the Next Generation Interceptor (NGI) mission. Under the award, Teledyne will deliver NGI mechanical ground support equipment to Lockheed Martin.

Catching Up With Echo Yang of Archer Circuits

11/10/2026 | Dan Beaulieu, D.B. Management Group
I’ve always believed the most interesting thing about a PCB company is the person who decided what kind of company it should be. Echo Yang chose to build Archer Circuits around engineering support, manufacturing options, and long-term customer relationships. I caught up with Echo to talk about the road that led her here, what customers are asking for today, and what it takes to earn their trust. I think you will be surprised and, frankly, as impressed as I was by Echo and her company.
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