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MKS Inc. , a global provider of enabling technologies that transform our world, announced that its strategic brand Atotech, offering process chemicals, equipment, software, and services, will exhibit at SEDEX 2026, taking place October 14-16, 2026, in Seoul, South Korea. The company will showcase process chemicals, equipment, software, and services designed to help semiconductor manufacturers address the evolving requirements of AI-driven applications, high-performance computing (HPC), and next-generation advanced packaging.
As artificial intelligence continues to drive higher performance requirements and increasing package complexity, manufacturers face growing challenges related to interconnect density, signal integrity, package reliability, and manufacturing efficiency. MKS’ Atotech supports these evolving requirements with advanced metallization technologies that enable next-generation semiconductor packaging architectures.
At SEDEX, visitors will learn how MKS’ Atotech technologies help enable advanced semiconductor interconnects and packaging solutions for AI accelerators, HPC processors, advanced memory devices, and data center infrastructure.
Technology highlights at SEDEX 2026
MKS’ Atotech will showcase solutions supporting key advanced packaging applications, including:
- Hybrid Bonding with Everplate® Cu 300 FG for low-temperature copper-to-copper bonding
- RDL and microvia formation using Spherolyte® Cu UF3 for fine-line redistribution and reliable via filling
- Cu pillar plating with Spherolyte® Cu UF5 for advanced package designs
- TSV filling technologies, including Spherolyte® Cu TSV AF for void-free filling of challenging geometries
- Diffusion barrier and electromagnetic shielding applicationss using Spherolyte® NiFe
- High-reliability solder-bump applications using Spherolyte® SnAg2
Visitors will also discover how these technologies support the industry’s transition toward higher-density interconnects, improved signal performance, increased integration, reduced power consumption, and smaller form factors for emerging AI applications.
“SEDEX provides an excellent opportunity to connect with customers and industry partners and discuss the trends shaping the future of semiconductor manufacturing,” said
Avery Gucheol Kim, Regional Marketing Manager, Korea and Southeast Asia, Materials Solutions Division, MKS’ Atotech. “As AI, high-performance computing, and advanced packaging continue to drive innovation, manufacturers are looking for solutions that support higher interconnect density, improved reliability, and increased process efficiency. We look forward to demonstrating how advanced metallization technologies help enable these next-generation applications.”
Visitors can meet with MKS’ Atotech experts at Booth D145 to discuss current industry trends and learn how advanced metallization solutions enable the next generation of semiconductor packaging and interconnect technologies.
